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制造商 系列 封装/外壳 包装 产品状态 位数 采样率(每秒) 输入数量 输入类型 数据接口 配置 比率 - S/H:ADC A/D 转换器数量 架构 基准类型 电压 - 电源,模拟 电压 - 电源,数字 特性 工作温度 供应商设备封装 安装类型 等级 认证



















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
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结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 位数 采样率(每秒) 输入数量 输入类型 数据接口 配置 比率 - S/H:ADC A/D 转换器数量 架构 基准类型 电压 - 电源,模拟 电压 - 电源,数字 特性 工作温度 供应商设备封装 安装类型 等级 认证
MCP37D11-200E/TE

MCP37D11-200E/TE

IC ADC 12BIT PIPELINED 121TFBGA

Microchip Technology

4,406 -
MCP37D11-200E/TE

数据手册

- 121-TFBGA Tray Active 12 200M 1, 2, 4, 8 Differential LVDS - Parallel, Parallel MUX-S/H-ADC 1:1 1 Pipelined Internal 1.14V ~ 1.89V 1.14V ~ 1.89V - -40°C ~ 125°C 121-TFBGA (8x8) Surface Mount - -
MCP37D21-200E/TE

MCP37D21-200E/TE

IC ADC 14BIT PIPELINED 121TFBGA

Microchip Technology

3,022 -
MCP37D21-200E/TE

数据手册

- 121-TFBGA Tray Active 14 200M 1, 2, 4, 8 Differential LVDS - Parallel, Parallel MUX-S/H-ADC 1:1 1 Pipelined Internal 1.14V ~ 1.89V 1.14V ~ 1.89V - -40°C ~ 125°C 121-TFBGA (8x8) Surface Mount Automotive AEC-Q100
TC850CLW713

TC850CLW713

IC ADC 15BIT DUAL SLOPE 44PLCC

Microchip Technology

2,552 27.99
TC850CLW713

数据手册

- 44-LCC (J-Lead) Tape & Reel (TR) Active 15 40 1 Differential Parallel MUX-ADC - 1 Dual Slope External ±5V ±5V - 0°C ~ 70°C 44-PLCC (16.59x16.59) Surface Mount - -
MCP37231-200E/TE

MCP37231-200E/TE

IC ADC 16BIT PIPELINED 121TFBGA

Microchip Technology

1,696 -
MCP37231-200E/TE

数据手册

- 121-TFBGA Tray Active 16 200M 8 Differential LVDS - Parallel, Parallel MUX-S/H-ADC 1:1 1 Pipelined Internal 1.14V ~ 1.89V 1.14V ~ 1.89V - -40°C ~ 125°C 121-TFBGA (8x8) Surface Mount - -
MCP37211-200I/TE

MCP37211-200I/TE

IC ADC 12BIT PIPELINED 121TFBGA

Microchip Technology

1,856 32.04
MCP37211-200I/TE

数据手册

- 121-TFBGA Tray Active 12 200M 1, 2, 4, 8 Differential LVDS - Parallel, Parallel MUX-ADC - 1 Pipelined Internal 1.14V ~ 1.26V, 1.71V ~ 1.89V 1.14V ~ 1.26V, 1.71V ~ 1.89V - -40°C ~ 85°C 121-TFBGA (8x8) Surface Mount - -
TC850CLW

TC850CLW

IC ADC 15BIT DUAL SLOPE 44PLCC

Microchip Technology

4,868 39.35
TC850CLW

数据手册

- 44-LCC (J-Lead) Tube Active 15 40 1 Differential Parallel MUX-ADC - 1 Dual Slope External ±5V ±5V - 0°C ~ 70°C 44-PLCC (16.59x16.59) Surface Mount - -
TC850ILW

TC850ILW

IC ADC 15BIT DUAL SLOPE 44PLCC

Microchip Technology

2,163 34.10
TC850ILW

数据手册

- 44-LCC (J-Lead) Tube Active 15 40 1 Differential Parallel MUX-ADC - 1 Dual Slope External ±5V ±5V - -25°C ~ 85°C 44-PLCC (16.59x16.59) Surface Mount - -
TC850CPL

TC850CPL

IC ADC 15BIT DUAL SLOPE 40DIP

Microchip Technology

4,104 35.19
TC850CPL

数据手册

- 40-DIP (0.600", 15.24mm) Tube Active 15 40 1 Differential Parallel MUX-ADC - 1 Dual Slope External ±5V ±5V - 0°C ~ 70°C 40-PDIP Through Hole - -
MCP37D21-200I/TE

MCP37D21-200I/TE

IC ADC 14BIT PIPELINED 121TFBGA

Microchip Technology

4,478 66.35
MCP37D21-200I/TE

数据手册

- 121-TFBGA Tray Active 14 200M 1, 2, 4, 8 Differential LVDS - Parallel, Parallel MUX-ADC - 1 Pipelined Internal 1.14V ~ 1.26V, 1.71V ~ 1.89V 1.14V ~ 1.26V, 1.71V ~ 1.89V - -40°C ~ 85°C 121-TFBGA (8x8) Surface Mount - -
MCP37231-200I/TE

MCP37231-200I/TE

IC ADC 16BIT PIPELINED 121TFBGA

Microchip Technology

3,558 90.58
MCP37231-200I/TE

数据手册

- 121-TFBGA Tray Active 16 200M 1, 2, 4, 8 Differential LVDS - Parallel, Parallel MUX-ADC - 1 Pipelined Internal 1.14V ~ 1.26V, 1.71V ~ 1.89V 1.14V ~ 1.26V, 1.71V ~ 1.89V - -40°C ~ 85°C 121-TFBGA (8x8) Surface Mount - -