产品中心

制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
M7AFS600-FG256

M7AFS600-FG256

IC FPGA 119 I/O 256FBGA

Microchip Technology

3,103 203.30

-

Fusion® 256-LBGA Tray Active Not Verified - - 110592 119 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 70°C (TA) - - 256-FPBGA (17x17)
M7AFS600-FGG256

M7AFS600-FGG256

IC FPGA 119 I/O 256FBGA

Microchip Technology

2,653 203.30

-

Fusion® 256-LBGA Tray Active Not Verified - - 110592 119 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 70°C (TA) - - 256-FPBGA (17x17)
M1A3PE1500-2PQG208

M1A3PE1500-2PQG208

IC FPGA 147 I/O 208QFP

Microchip Technology

2,957 199.73
M1A3PE1500-2PQG208

数据手册

ProASIC3E 208-BFQFP Tray Active Not Verified - - 276480 147 1500000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 208-PQFP (28x28)
A3PE1500-2PQG208

A3PE1500-2PQG208

IC FPGA 147 I/O 208QFP

Microchip Technology

1,827 199.73
A3PE1500-2PQG208

数据手册

ProASIC3E 208-BFQFP Tray Active Not Verified - - 276480 147 1500000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 208-PQFP (28x28)
M2GL090-1FG676I

M2GL090-1FG676I

IC FPGA 425 I/O 676FBGA

Microchip Technology

3,262 212.42
M2GL090-1FG676I

数据手册

IGLOO2 676-BGA Tray Active Not Verified - 86316 2648064 425 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 676-FBGA (27x27)
M2GL090-1FGG676I

M2GL090-1FGG676I

IC FPGA 425 I/O 676FBGA

Microchip Technology

1,830 212.42
M2GL090-1FGG676I

数据手册

IGLOO2 676-BGA Tray Active Not Verified - 86316 2648064 425 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 676-FBGA (27x27)
A54SX32A-TQG100A

A54SX32A-TQG100A

IC FPGA 81 I/O 100TQFP

Microchip Technology

1,333 203.95
A54SX32A-TQG100A

数据手册

SX-A 100-LQFP Tray Active Not Verified 2880 - - 81 48000 2.25V ~ 5.25V Surface Mount -40°C ~ 125°C (TA) - - 100-TQFP (14x14)
MPF100TL-FCG484I

MPF100TL-FCG484I

IC FPGA 244 I/O 484FBGA

Microchip Technology

4,752 229.77
MPF100TL-FCG484I

数据手册

PolarFire™ 484-BFBGA Tray Active Not Verified - 109000 7782400 244 - 0.97V ~ 1.08V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (19x19)
A42MX24-FTQG176

A42MX24-FTQG176

IC FPGA 150 I/O 176TQFP

Microchip Technology

1,368 202.60
A42MX24-FTQG176

数据手册

MX 176-LQFP Tray Active Not Verified - - - 150 36000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 176-TQFP (24x24)
A42MX09-1PQG160I

A42MX09-1PQG160I

IC FPGA 101 I/O 160QFP

Microchip Technology

4,664 201.82
A42MX09-1PQG160I

数据手册

MX 160-BQFP Tray Active Not Verified - - - 101 14000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 160-PQFP (28x28)
A42MX24-FPQG208

A42MX24-FPQG208

IC FPGA 176 I/O 208QFP

Microchip Technology

4,843 202.17
A42MX24-FPQG208

数据手册

MX 208-BFQFP Tray Active Not Verified - - - 176 36000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 208-PQFP (28x28)
M1A3P1000L-1FG256I

M1A3P1000L-1FG256I

IC FPGA 177 I/O 256FBGA

Microchip Technology

4,476 202.90
M1A3P1000L-1FG256I

数据手册

ProASIC3L 256-LBGA Tray Active Not Verified - - 147456 177 1000000 1.14V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
A42MX09-PQG160A

A42MX09-PQG160A

IC FPGA 101 I/O 160QFP

Microchip Technology

4,310 207.91
A42MX09-PQG160A

数据手册

MX 160-BQFP Tray Active Not Verified - - - 101 14000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 125°C (TA) - - 160-PQFP (28x28)
APA300-FGG144

APA300-FGG144

IC FPGA 100 I/O 144FBGA

Microchip Technology

3,138 210.86
APA300-FGG144

数据手册

ProASICPLUS 144-LBGA Tray Active Not Verified - - 73728 100 300000 2.3V ~ 2.7V Surface Mount 0°C ~ 70°C (TA) - - 144-FPBGA (13x13)
APA300-FG144

APA300-FG144

IC FPGA 100 I/O 144FBGA

Microchip Technology

1,763 210.86
APA300-FG144

数据手册

ProASICPLUS 144-LBGA Tray Active Not Verified - - 73728 100 300000 2.3V ~ 2.7V Surface Mount 0°C ~ 70°C (TA) - - 144-FPBGA (13x13)
A42MX09-3PLG84I

A42MX09-3PLG84I

IC FPGA 72 I/O 84PLCC

Microchip Technology

2,399 204.53
A42MX09-3PLG84I

数据手册

MX 84-LCC (J-Lead) Tray Last Time Buy Not Verified - - - 72 14000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 84-PLCC (29.31x29.31)
A42MX09-2PQG160

A42MX09-2PQG160

IC FPGA 101 I/O 160QFP

Microchip Technology

4,013 204.86
A42MX09-2PQG160

数据手册

MX 160-BQFP Tray Active Not Verified - - - 101 14000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 160-PQFP (28x28)
A42MX16-2PLG84

A42MX16-2PLG84

IC FPGA 72 I/O 84PLCC

Microchip Technology

3,013 206.53
A42MX16-2PLG84

数据手册

MX 84-LCC (J-Lead) Tray Last Time Buy Not Verified - - - 72 24000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 84-PLCC (29.31x29.31)
APA300-FG256

APA300-FG256

IC FPGA 186 I/O 256FBGA

Microchip Technology

2,420 210.86
APA300-FG256

数据手册

ProASICPLUS 256-LBGA Tray Active Not Verified - - 73728 186 300000 2.3V ~ 2.7V Surface Mount 0°C ~ 70°C (TA) - - 256-FPBGA (17x17)
A42MX09-3PQG100I

A42MX09-3PQG100I

IC FPGA 83 I/O 100QFP

Microchip Technology

1,304 208.22
A42MX09-3PQG100I

数据手册

MX 100-BQFP Tray Active Not Verified - - - 83 14000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 100-PQFP (20x14)