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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
A54SX32A-1BGG329

A54SX32A-1BGG329

IC FPGA 249 I/O 329BGA

Microchip Technology

1,068 265.15
A54SX32A-1BGG329

数据手册

SX-A 329-BBGA Tray Active Not Verified 2880 - - 249 48000 2.25V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 329-PBGA (31x31)
A54SX32A-1BG329

A54SX32A-1BG329

IC FPGA 249 I/O 329BGA

Microchip Technology

1,879 265.15
A54SX32A-1BG329

数据手册

SX-A 329-BBGA Tray Active Not Verified 2880 - - 249 48000 2.25V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 329-PBGA (31x31)
A54SX32A-BGG329I

A54SX32A-BGG329I

IC FPGA 249 I/O 329BGA

Microchip Technology

1,193 265.15
A54SX32A-BGG329I

数据手册

SX-A 329-BBGA Tray Active Not Verified 2880 - - 249 48000 2.25V ~ 5.25V Surface Mount -40°C ~ 85°C (TA) - - 329-PBGA (31x31)
A42MX16-2PQG208I

A42MX16-2PQG208I

IC FPGA 140 I/O 208QFP

Microchip Technology

3,326 264.08
A42MX16-2PQG208I

数据手册

MX 208-BFQFP Tray Active Not Verified - - - 140 24000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 208-PQFP (28x28)
M1A3P1000-1PQG208M

M1A3P1000-1PQG208M

IC FPGA 154 I/O 208QFP

Microchip Technology

2,160 266.30
M1A3P1000-1PQG208M

数据手册

ProASIC3 208-BFQFP Tray Active Not Verified - - 147456 154 1000000 1.425V ~ 1.575V Surface Mount -55°C ~ 125°C (TJ) - - 208-PQFP (28x28)
A3P1000-1PQG208M

A3P1000-1PQG208M

IC FPGA 154 I/O 208QFP

Microchip Technology

4,859 266.30
A3P1000-1PQG208M

数据手册

ProASIC3 208-BFQFP Tray Active Not Verified - - 147456 154 1000000 1.425V ~ 1.575V Surface Mount -55°C ~ 125°C (TJ) - - 208-PQFP (28x28)
A54SX32A-2TQG144I

A54SX32A-2TQG144I

IC FPGA 113 I/O 144TQFP

Microchip Technology

4,817 267.60
A54SX32A-2TQG144I

数据手册

SX-A 144-LQFP Tray Active Not Verified 2880 - - 113 48000 2.25V ~ 5.25V Surface Mount -40°C ~ 85°C (TA) - - 144-TQFP (20x20)
APA300-FGG256I

APA300-FGG256I

IC FPGA 186 I/O 256FBGA

Microchip Technology

3,336 273.86
APA300-FGG256I

数据手册

ProASICPLUS 256-LBGA Tray Active Not Verified - - 73728 186 300000 2.3V ~ 2.7V Surface Mount -40°C ~ 85°C (TA) - - 256-FPBGA (17x17)
A42MX09-3TQG176I

A42MX09-3TQG176I

IC FPGA 104 I/O 176TQFP

Microchip Technology

3,312 271.22
A42MX09-3TQG176I

数据手册

MX 176-LQFP Tray Active Not Verified - - - 104 14000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 176-TQFP (24x24)
M1AFS600-FGG484I

M1AFS600-FGG484I

IC FPGA 172 I/O 484FBGA

Microchip Technology

2,900 275.87
M1AFS600-FGG484I

数据手册

Fusion® 484-BGA Tray Active Not Verified - - 110592 172 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
M1AFS600-FG484I

M1AFS600-FG484I

IC FPGA 172 I/O 484FBGA

Microchip Technology

3,565 275.87
M1AFS600-FG484I

数据手册

Fusion® 484-BGA Tray Active Not Verified - - 110592 172 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
AX250-2FG256

AX250-2FG256

IC FPGA 138 I/O 256FBGA

Microchip Technology

4,930 272.26
AX250-2FG256

数据手册

Axcelerator 256-LBGA Tray Active Not Verified 4224 - 55296 138 250000 1.425V ~ 1.575V Surface Mount 0°C ~ 70°C (TA) - - 256-FPBGA (17x17)
AX250-2FGG256

AX250-2FGG256

IC FPGA 138 I/O 256FBGA

Microchip Technology

3,275 272.26
AX250-2FGG256

数据手册

Axcelerator 256-LBGA Tray Active Not Verified 4224 - 55296 138 250000 1.425V ~ 1.575V Surface Mount 0°C ~ 70°C (TA) - - 256-FPBGA (17x17)
A54SX16-1TQG176

A54SX16-1TQG176

IC FPGA 147 I/O 176TQFP

Microchip Technology

4,360 276.28
A54SX16-1TQG176

数据手册

SX 176-LQFP Tray Active Not Verified 1452 - - 147 24000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 176-TQFP (24x24)
A54SX16-TQG176I

A54SX16-TQG176I

IC FPGA 147 I/O 176TQFP

Microchip Technology

1,343 276.28
A54SX16-TQG176I

数据手册

SX 176-LQFP Tray Active Not Verified 1452 - - 147 24000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount -40°C ~ 85°C (TA) - - 176-TQFP (24x24)
M1AFS600-2FGG256I

M1AFS600-2FGG256I

IC FPGA 119 I/O 256FBGA

Microchip Technology

1,935 282.19
M1AFS600-2FGG256I

数据手册

Fusion® 256-LBGA Tray Active Not Verified - - 110592 119 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
P1AFS600-2FGG256I

P1AFS600-2FGG256I

IC FPGA 119 I/O 256FBGA

Microchip Technology

4,413 282.19
P1AFS600-2FGG256I

数据手册

Fusion® 256-LBGA Tray Active Not Verified - - 110592 119 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
AFS600-2FG256I

AFS600-2FG256I

IC FPGA 119 I/O 256FBGA

Microchip Technology

3,260 282.19
AFS600-2FG256I

数据手册

Fusion® 256-LBGA Tray Active Not Verified - - 110592 119 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
P1AFS600-2FG256I

P1AFS600-2FG256I

IC FPGA 119 I/O 256FBGA

Microchip Technology

2,060 282.19
P1AFS600-2FG256I

数据手册

Fusion® 256-LBGA Tray Active Not Verified - - 110592 119 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
AFS600-2FGG256I

AFS600-2FGG256I

IC FPGA 119 I/O 256FBGA

Microchip Technology

3,522 282.19
AFS600-2FGG256I

数据手册

Fusion® 256-LBGA Tray Active Not Verified - - 110592 119 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)