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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
M1AFS1500-1FG256

M1AFS1500-1FG256

IC FPGA 119 I/O 256FBGA

Microchip Technology

1,730 412.70
M1AFS1500-1FG256

数据手册

Fusion® 256-LBGA Tray Active Not Verified - - 276480 119 1500000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)
APA450-FG256I

APA450-FG256I

IC FPGA 186 I/O 256FBGA

Microchip Technology

2,229 413.44
APA450-FG256I

数据手册

ProASICPLUS 256-LBGA Tray Active Not Verified - - 110592 186 450000 2.3V ~ 2.7V Surface Mount -40°C ~ 85°C (TA) - - 256-FPBGA (17x17)
APA450-FGG256I

APA450-FGG256I

IC FPGA 186 I/O 256FBGA

Microchip Technology

3,775 413.44
APA450-FGG256I

数据手册

ProASICPLUS 256-LBGA Tray Active Not Verified - - 110592 186 450000 2.3V ~ 2.7V Surface Mount -40°C ~ 85°C (TA) - - 256-FPBGA (17x17)
M1A3PE3000-1FGG324

M1A3PE3000-1FGG324

IC FPGA 221 I/O 324FBGA

Microchip Technology

3,190 406.27
M1A3PE3000-1FGG324

数据手册

ProASIC3E 324-BGA Tray Active Not Verified - - 516096 221 3000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 324-FBGA (19x19)
M1A3PE3000-1FG324

M1A3PE3000-1FG324

IC FPGA 221 I/O 324FBGA

Microchip Technology

3,627 406.27
M1A3PE3000-1FG324

数据手册

ProASIC3E 324-BGA Tray Active Not Verified - - 516096 221 3000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 324-FBGA (19x19)
A3PE3000-1FGG324

A3PE3000-1FGG324

IC FPGA 221 I/O 324FBGA

Microchip Technology

3,564 406.27
A3PE3000-1FGG324

数据手册

ProASIC3E 324-BGA Tray Active Not Verified - - 516096 221 3000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 324-FBGA (19x19)
A3PE3000-1FG324

A3PE3000-1FG324

IC FPGA 221 I/O 324FBGA

Microchip Technology

1,938 406.27
A3PE3000-1FG324

数据手册

ProASIC3E 324-BGA Tray Active Not Verified - - 516096 221 3000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 324-FBGA (19x19)
A42MX24-2PQG208

A42MX24-2PQG208

IC FPGA 176 I/O 208QFP

Microchip Technology

2,094 407.02
A42MX24-2PQG208

数据手册

MX 208-BFQFP Tray Active Not Verified - - - 176 36000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 208-PQFP (28x28)
A42MX24-PQG160A

A42MX24-PQG160A

IC FPGA 125 I/O 160QFP

Microchip Technology

2,681 414.76
A42MX24-PQG160A

数据手册

MX 160-BQFP Tray Active Not Verified - - - 125 36000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 125°C (TA) - - 160-PQFP (28x28)
A42MX24-3PLG84I

A42MX24-3PLG84I

IC FPGA 72 I/O 84PLCC

Microchip Technology

4,520 408.03
A42MX24-3PLG84I

数据手册

MX 84-LCC (J-Lead) Tray Last Time Buy Not Verified - - - 72 36000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 84-PLCC (29.31x29.31)
A42MX24-2PQG160I

A42MX24-2PQG160I

IC FPGA 125 I/O 160QFP

Microchip Technology

1,760 408.36
A42MX24-2PQG160I

数据手册

MX 160-BQFP Tray Active Not Verified - - - 125 36000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 160-PQFP (28x28)
A3PE3000-FG896

A3PE3000-FG896

IC FPGA 620 I/O 896FBGA

Microchip Technology

2,244 408.48
A3PE3000-FG896

数据手册

ProASIC3E 896-BGA Tray Active Not Verified - - 516096 620 3000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 896-FBGA (31x31)
A3PE3000-FGG896

A3PE3000-FGG896

IC FPGA 620 I/O 896FBGA

Microchip Technology

2,893 408.48
A3PE3000-FGG896

数据手册

ProASIC3E 896-BGA Tray Active Not Verified - - 516096 620 3000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 896-FBGA (31x31)
M1A3PE3000-FGG896

M1A3PE3000-FGG896

IC FPGA 620 I/O 896FBGA

Microchip Technology

2,736 408.48
M1A3PE3000-FGG896

数据手册

ProASIC3E 896-BGA Tray Active Not Verified - - 516096 620 3000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 896-FBGA (31x31)
M1A3PE3000-FG896

M1A3PE3000-FG896

IC FPGA 620 I/O 896FBGA

Microchip Technology

4,002 408.48
M1A3PE3000-FG896

数据手册

ProASIC3E 896-BGA Tray Active Not Verified - - 516096 620 3000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 896-FBGA (31x31)
A42MX24-1TQG176I

A42MX24-1TQG176I

IC FPGA 150 I/O 176TQFP

Microchip Technology

2,127 412.46
A42MX24-1TQG176I

数据手册

MX 176-LQFP Tray Active Not Verified - - - 150 36000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 176-TQFP (24x24)
M1A3PE3000-1FGG484

M1A3PE3000-1FGG484

IC FPGA 341 I/O 484FBGA

Microchip Technology

3,651 411.21
M1A3PE3000-1FGG484

数据手册

ProASIC3E 484-BGA Tray Active Not Verified - - 516096 341 3000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
A3PE3000-1FGG484

A3PE3000-1FGG484

IC FPGA 341 I/O 484FBGA

Microchip Technology

2,872 411.21
A3PE3000-1FGG484

数据手册

ProASIC3E 484-BGA Tray Active Not Verified - - 516096 341 3000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
A3PE3000-1FG484

A3PE3000-1FG484

IC FPGA 341 I/O 484FBGA

Microchip Technology

2,411 411.21
A3PE3000-1FG484

数据手册

ProASIC3E 484-BGA Tray Active Not Verified - - 516096 341 3000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M1A3PE3000-1FG484

M1A3PE3000-1FG484

IC FPGA 341 I/O 484FBGA

Microchip Technology

2,436 411.21
M1A3PE3000-1FG484

数据手册

ProASIC3E 484-BGA Tray Active Not Verified - - 516096 341 3000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)