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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
M2GL050-1FCS325

M2GL050-1FCS325

IC FPGA 200 I/O 325BGA

Microchip Technology

1,432 76.97
M2GL050-1FCS325

数据手册

IGLOO2 325-TFBGA, FCBGA Tray Active Not Verified - 56340 1869824 200 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 325-FCBGA (11x11)
M2GL050-1FCSG325

M2GL050-1FCSG325

IC FPGA 200 I/O 324CSBGA

Microchip Technology

1,846 76.97
M2GL050-1FCSG325

数据手册

IGLOO2 325-TFBGA, FCBGA Tray Active Not Verified - 56340 1869824 200 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 325-FCBGA (11x11)
M2GL050-FCS325I

M2GL050-FCS325I

IC FPGA 200 I/O 325BGA

Microchip Technology

3,934 76.97
M2GL050-FCS325I

数据手册

IGLOO2 325-TFBGA, FCBGA Tray Active Not Verified - 56340 1869824 200 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 325-FCBGA (11x11)
M2GL060-1FCS325

M2GL060-1FCS325

IC FPGA 200 I/O 325BGA

Microchip Technology

1,133 76.97
M2GL060-1FCS325

数据手册

IGLOO2 325-TFBGA, FCBGA Tray Active Not Verified - 56520 1869824 200 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 325-FCBGA (11x11)
M2GL060-1FCSG325

M2GL060-1FCSG325

IC FPGA 200 I/O 324CSBGA

Microchip Technology

4,863 76.97
M2GL060-1FCSG325

数据手册

IGLOO2 325-TFBGA, FCBGA Tray Active Not Verified - 56520 1869824 200 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 325-FCBGA (11x11)
M2GL060-FCS325I

M2GL060-FCS325I

IC FPGA 200 I/O 325BGA

Microchip Technology

3,917 76.97
M2GL060-FCS325I

数据手册

IGLOO2 325-TFBGA, FCBGA Tray Active Not Verified - 56520 1869824 200 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 325-FCBGA (11x11)
M1A3P1000-FG256

M1A3P1000-FG256

IC FPGA 177 I/O 256FBGA

Microchip Technology

3,233 70.82

-

ProASIC3 256-LBGA Tray Active Not Verified - - 147456 177 1000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)
A3P1000-FG256

A3P1000-FG256

IC FPGA 177 I/O 256FBGA

Microchip Technology

3,174 70.82
A3P1000-FG256

数据手册

ProASIC3 256-LBGA Tray Active Not Verified - - 147456 177 1000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)
M1A3P1000-FGG256

M1A3P1000-FGG256

IC FPGA 177 I/O 256FBGA

Microchip Technology

1,170 70.82

-

ProASIC3 256-LBGA Tray Active Not Verified - - 147456 177 1000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)
M1A3P600-1FGG484I

M1A3P600-1FGG484I

IC FPGA 235 I/O 484FBGA

Microchip Technology

1,780 71.10
M1A3P600-1FGG484I

数据手册

ProASIC3 484-BGA Tray Active Not Verified - - 110592 235 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)