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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
M1A3P600-1FG484I

M1A3P600-1FG484I

IC FPGA 235 I/O 484FBGA

Microchip Technology

3,757 71.10
M1A3P600-1FG484I

数据手册

ProASIC3 484-BGA Tray Active Not Verified - - 110592 235 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
EX128-PTQG64I

EX128-PTQG64I

IC FPGA 46 I/O 64TQFP

Microchip Technology

2,937 72.59
EX128-PTQG64I

数据手册

EX 64-LQFP Tray Active Not Verified - 256 - 46 6000 2.3V ~ 2.7V Surface Mount -40°C ~ 85°C (TA) - - 64-TQFP (10x10)
A54SX08A-TQG144

A54SX08A-TQG144

IC FPGA 113 I/O 144TQFP

Microchip Technology

3,322 71.69
A54SX08A-TQG144

数据手册

SX-A 144-LQFP Tray Active Not Verified 768 - - 113 12000 2.25V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 144-TQFP (20x20)
A3P1000-1FG144

A3P1000-1FG144

IC FPGA 97 I/O 144FBGA

Microchip Technology

3,692 71.40
A3P1000-1FG144

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 147456 97 1000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 144-FPBGA (13x13)
M1A3P1000-1FGG144

M1A3P1000-1FGG144

IC FPGA 97 I/O 144FBGA

Microchip Technology

1,464 71.40

-

ProASIC3 144-LBGA Tray Active Not Verified - - 147456 97 1000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 144-FPBGA (13x13)
A3P1000-1FGG144

A3P1000-1FGG144

IC FPGA 97 I/O 144FBGA

Microchip Technology

3,244 71.40
A3P1000-1FGG144

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 147456 97 1000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 144-FPBGA (13x13)
M1A3P1000-1FG144

M1A3P1000-1FG144

IC FPGA 97 I/O 144FBGA

Microchip Technology

2,831 71.40

-

ProASIC3 144-LBGA Tray Active Not Verified - - 147456 97 1000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 144-FPBGA (13x13)
A40MX02-2PLG68

A40MX02-2PLG68

IC FPGA 57 I/O 68PLCC

Microchip Technology

1,347 71.94
A40MX02-2PLG68

数据手册

MX 68-LCC (J-Lead) Tray Active Not Verified - - - 57 3000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 68-PLCC (24.23x24.23)
AGL600V5-FG144

AGL600V5-FG144

IC FPGA 97 I/O 144FBGA

Microchip Technology

1,755 73.31
AGL600V5-FG144

数据手册

IGLOO 144-LBGA Tray Active Not Verified - 13824 110592 97 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 70°C (TA) - - 144-FPBGA (13x13)
M1AGL600V5-FG144

M1AGL600V5-FG144

IC FPGA 97 I/O 144FBGA

Microchip Technology

2,080 73.31
M1AGL600V5-FG144

数据手册

IGLOO 144-LBGA Tray Active Not Verified - 13824 110592 97 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 70°C (TA) - - 144-FPBGA (13x13)