产品中心

制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
M1AGL600V5-FGG144

M1AGL600V5-FGG144

IC FPGA 97 I/O 144FBGA

Microchip Technology

4,136 73.31
M1AGL600V5-FGG144

数据手册

IGLOO 144-LBGA Tray Active Not Verified - 13824 110592 97 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 70°C (TA) - - 144-FPBGA (13x13)
AT40K20-2BGI

AT40K20-2BGI

IC FPGA 289 I/O 352SBGA

Microchip Technology

3,520 -

-

AT40K/KLV 352-LBGA Tray Obsolete Not Verified - 1024 8192 289 30000 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TC) - - 352-SBGA (35x35)
M1A3P1000-PQG208

M1A3P1000-PQG208

IC FPGA 154 I/O 208QFP

Microchip Technology

2,554 73.38

-

ProASIC3 208-BFQFP Tray Active Not Verified - - 147456 154 1000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 208-PQFP (28x28)
A3PE600-FGG484

A3PE600-FGG484

IC FPGA 270 I/O 484FBGA

Microchip Technology

4,009 73.73
A3PE600-FGG484

数据手册

ProASIC3E 484-BGA Tray Active Not Verified - - 110592 270 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
A3PE600-FG484

A3PE600-FG484

IC FPGA 270 I/O 484FBGA

Microchip Technology

3,905 73.73
A3PE600-FG484

数据手册

ProASIC3E 484-BGA Tray Active Not Verified - - 110592 270 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
A3PE600-2FG256

A3PE600-2FG256

IC FPGA 165 I/O 256FBGA

Microchip Technology

2,282 74.07
A3PE600-2FG256

数据手册

ProASIC3E 256-LBGA Tray Active Not Verified - - 110592 165 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)
A3PE600-2FGG256

A3PE600-2FGG256

IC FPGA 165 I/O 256FBGA

Microchip Technology

3,305 74.07
A3PE600-2FGG256

数据手册

ProASIC3E 256-LBGA Tray Active Not Verified - - 110592 165 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)
A3P600L-FG484

A3P600L-FG484

IC FPGA 235 I/O 484FBGA

Microchip Technology

1,361 74.17
A3P600L-FG484

数据手册

ProASIC3L 484-BGA Tray Active Not Verified - - 110592 235 600000 1.14V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M1A3P600L-FG484

M1A3P600L-FG484

IC FPGA 235 I/O 484FBGA

Microchip Technology

2,283 74.17
M1A3P600L-FG484

数据手册

ProASIC3L 484-BGA Tray Active Not Verified - - 110592 235 600000 1.14V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
A42MX09-FVQG100

A42MX09-FVQG100

IC FPGA 83 I/O 100VQFP

Microchip Technology

2,029 74.95
A42MX09-FVQG100

数据手册

MX 100-TQFP Tray Active Not Verified - - - 83 14000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 100-VQFP (14x14)