产品中心

制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
M2GL050TS-FCS325

M2GL050TS-FCS325

IC FPGA 200 I/O 325BGA

Microchip Technology

4,571 83.66
M2GL050TS-FCS325

数据手册

IGLOO2 325-TFBGA, FCBGA Tray Active Not Verified - 56340 1869824 200 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 325-FCBGA (11x11)
M2GL050TS-FCSG325

M2GL050TS-FCSG325

IC FPGA 200 I/O 324CSBGA

Microchip Technology

2,910 83.66
M2GL050TS-FCSG325

数据手册

IGLOO2 325-TFBGA, FCBGA Tray Active Not Verified - 56340 1869824 200 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 325-FCBGA (11x11)
M2GL060T-1FCS325

M2GL060T-1FCS325

IC FPGA 200 I/O 325BGA

Microchip Technology

3,835 83.66
M2GL060T-1FCS325

数据手册

IGLOO2 325-TFBGA, FCBGA Tray Active Not Verified - 56520 1869824 200 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 325-FCBGA (11x11)
M2GL060T-1FCSG325

M2GL060T-1FCSG325

IC FPGA 200 I/O 324CSBGA

Microchip Technology

1,449 83.66
M2GL060T-1FCSG325

数据手册

IGLOO2 325-TFBGA, FCBGA Tray Active Not Verified - 56520 1869824 200 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 325-FCBGA (11x11)
M2GL060T-FCS325I

M2GL060T-FCS325I

IC FPGA 200 I/O 325BGA

Microchip Technology

2,739 83.66
M2GL060T-FCS325I

数据手册

IGLOO2 325-TFBGA, FCBGA Tray Active Not Verified - 56520 1869824 200 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 325-FCBGA (11x11)
M2GL060T-FCSG325I

M2GL060T-FCSG325I

IC FPGA 200 I/O 324CSBGA

Microchip Technology

4,347 83.66
M2GL060T-FCSG325I

数据手册

IGLOO2 325-TFBGA, FCBGA Tray Active Not Verified - 56520 1869824 200 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 325-FCBGA (11x11)
M2GL060TS-FCS325

M2GL060TS-FCS325

IC FPGA 200 I/O 325BGA

Microchip Technology

4,519 83.66
M2GL060TS-FCS325

数据手册

IGLOO2 325-TFBGA, FCBGA Tray Active Not Verified - 56520 1869824 200 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 325-FCBGA (11x11)
M2GL060TS-FCSG325

M2GL060TS-FCSG325

IC FPGA 200 I/O 324CSBGA

Microchip Technology

4,554 83.66
M2GL060TS-FCSG325

数据手册

IGLOO2 325-TFBGA, FCBGA Tray Active Not Verified - 56520 1869824 200 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 325-FCBGA (11x11)
A40MX02-1PQG100

A40MX02-1PQG100

IC FPGA 57 I/O 100QFP

Microchip Technology

2,370 77.26
A40MX02-1PQG100

数据手册

MX 100-BQFP Tray Active Not Verified - - - 57 3000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 100-PQFP (20x14)
M1A3P1000-1FGG256

M1A3P1000-1FGG256

IC FPGA 177 I/O 256FBGA

Microchip Technology

3,645 77.13

-

ProASIC3 256-LBGA Tray Active Not Verified - - 147456 177 1000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)