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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
A3P1000-1FGG256

A3P1000-1FGG256

IC FPGA 177 I/O 256FBGA

Microchip Technology

2,119 77.13
A3P1000-1FGG256

数据手册

ProASIC3 256-LBGA Tray Active Not Verified - - 147456 177 1000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)
M1A3P1000-1FG256

M1A3P1000-1FG256

IC FPGA 177 I/O 256FBGA

Microchip Technology

2,658 77.13

-

ProASIC3 256-LBGA Tray Active Not Verified - - 147456 177 1000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)
A3P1000-1FG256

A3P1000-1FG256

IC FPGA 177 I/O 256FBGA

Microchip Technology

1,934 77.13
A3P1000-1FG256

数据手册

ProASIC3 256-LBGA Tray Active Not Verified - - 147456 177 1000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)
A3P600-2FGG484I

A3P600-2FGG484I

IC FPGA 235 I/O 484FBGA

Microchip Technology

4,696 77.15
A3P600-2FGG484I

数据手册

ProASIC3 484-BGA Tray Active Not Verified - - 110592 235 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
M1A3P600-2FG484I

M1A3P600-2FG484I

IC FPGA 235 I/O 484FBGA

Microchip Technology

4,677 77.15
M1A3P600-2FG484I

数据手册

ProASIC3 484-BGA Tray Active Not Verified - - 110592 235 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
M1A3P600-2FGG484I

M1A3P600-2FGG484I

IC FPGA 235 I/O 484FBGA

Microchip Technology

4,300 77.15
M1A3P600-2FGG484I

数据手册

ProASIC3 484-BGA Tray Active Not Verified - - 110592 235 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
A40MX02-1PLG68I

A40MX02-1PLG68I

IC FPGA 57 I/O 68PLCC

Microchip Technology

1,559 77.59
A40MX02-1PLG68I

数据手册

MX 68-LCC (J-Lead) Tray Active Not Verified - - - 57 3000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 68-PLCC (24.23x24.23)
A3P1000-2FGG144

A3P1000-2FGG144

IC FPGA 97 I/O 144FBGA

Microchip Technology

3,726 77.60
A3P1000-2FGG144

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 147456 97 1000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 144-FPBGA (13x13)
M1A3P1000-2FGG144

M1A3P1000-2FGG144

IC FPGA 97 I/O 144FBGA

Microchip Technology

1,588 77.60

-

ProASIC3 144-LBGA Tray Active Not Verified - - 147456 97 1000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 144-FPBGA (13x13)
M1A3P1000-2FG144

M1A3P1000-2FG144

IC FPGA 97 I/O 144FBGA

Microchip Technology

3,765 77.60

-

ProASIC3 144-LBGA Tray Active Not Verified - - 147456 97 1000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 144-FPBGA (13x13)