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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
M1A3P250-2PQ208I

M1A3P250-2PQ208I

IC FPGA 151 I/O 208QFP

Microchip Technology

2,055 -
M1A3P250-2PQ208I

数据手册

ProASIC3 208-BFQFP Tray Obsolete Not Verified - - 36864 151 250000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 208-PQFP (28x28)
M1A3P250-PQ208I

M1A3P250-PQ208I

IC FPGA 151 I/O 208QFP

Microchip Technology

2,235 -
M1A3P250-PQ208I

数据手册

ProASIC3 208-BFQFP Tray Obsolete Not Verified - - 36864 151 250000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 208-PQFP (28x28)
M1A3P250-1PQ208I

M1A3P250-1PQ208I

IC FPGA 151 I/O 208QFP

Microchip Technology

4,011 -
M1A3P250-1PQ208I

数据手册

ProASIC3 208-BFQFP Tray Obsolete Not Verified - - 36864 151 250000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 208-PQFP (28x28)
A40MX04-FPL68

A40MX04-FPL68

IC FPGA 57 I/O 68PLCC

Microchip Technology

4,351 -
A40MX04-FPL68

数据手册

MX 68-LCC (J-Lead) Tray Obsolete Not Verified - - - 57 6000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 68-PLCC (24.23x24.23)
A40MX04-FPL84

A40MX04-FPL84

IC FPGA 69 I/O 84PLCC

Microchip Technology

4,720 -
A40MX04-FPL84

数据手册

MX 84-LCC (J-Lead) Tray Obsolete Not Verified - - - 69 6000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 84-PLCC (29.31x29.31)
A40MX02-PL44

A40MX02-PL44

IC FPGA 34 I/O 44PLCC

Microchip Technology

1,551 39.96
A40MX02-PL44

数据手册

MX 44-LCC (J-Lead) Tray Obsolete Not Verified - - - 34 3000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 44-PLCC (16.59x16.59)
A40MX04-FPL44

A40MX04-FPL44

IC FPGA 34 I/O 44PLCC

Microchip Technology

4,596 -
A40MX04-FPL44

数据手册

MX 44-LCC (J-Lead) Tray Obsolete Not Verified - - - 34 6000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 44-PLCC (16.59x16.59)
A3PE3000L-FGG324I

A3PE3000L-FGG324I

IC FPGA 221 I/O 324FBGA

Microchip Technology

1,327 -
A3PE3000L-FGG324I

数据手册

ProASIC3L 324-BGA Tray Active Not Verified - - 516096 221 3000000 1.14V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 324-FBGA (19x19)
A3PE3000L-FG324I

A3PE3000L-FG324I

IC FPGA 221 I/O 324FBGA

Microchip Technology

3,846 -
A3PE3000L-FG324I

数据手册

ProASIC3L 324-BGA Tray Active Not Verified - - 516096 221 3000000 1.14V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 324-FBGA (19x19)
A3PE3000L-1FGG324I

A3PE3000L-1FGG324I

IC FPGA 221 I/O 324FBGA

Microchip Technology

2,251 -
A3PE3000L-1FGG324I

数据手册

ProASIC3L 324-BGA Tray Active Not Verified - - 516096 221 3000000 1.14V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 324-FBGA (19x19)