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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
M1A3P600-1FG144I

M1A3P600-1FG144I

IC FPGA 97 I/O 144FBGA

Microchip Technology

3,881 52.25
M1A3P600-1FG144I

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 110592 97 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 144-FPBGA (13x13)
M1A3P600-FG256I

M1A3P600-FG256I

IC FPGA 177 I/O 256FBGA

Microchip Technology

4,379 53.08
M1A3P600-FG256I

数据手册

ProASIC3 256-LBGA Tray Active Not Verified - - 110592 177 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
M2GL025T-VF256

M2GL025T-VF256

IC FPGA 138 I/O 256FBGA

Microchip Technology

2,648 57.96
M2GL025T-VF256

数据手册

IGLOO2 256-LFBGA Tray Active Not Verified - 27696 1130496 138 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (14x14)
M2GL025T-VFG256

M2GL025T-VFG256

IC FPGA 138 I/O 256FBGA

Microchip Technology

3,106 57.96
M2GL025T-VFG256

数据手册

IGLOO2 256-LFBGA Tray Active Not Verified - 27696 1130496 138 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (14x14)
M2GL025T-VF400

M2GL025T-VF400

IC FPGA 207 I/O 400VFBGA

Microchip Technology

4,309 56.52
M2GL025T-VF400

数据手册

IGLOO2 400-LFBGA Tray Active Not Verified - 27696 1130496 207 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 400-VFBGA (17x17)
M2GL025T-VFG400

M2GL025T-VFG400

IC FPGA 195 I/O 400VFBGA

Microchip Technology

4,705 56.52
M2GL025T-VFG400

数据手册

IGLOO2 400-LFBGA Tray Active Not Verified - 27696 1130496 195 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 400-VFBGA (17x17)
M1A3P600-PQG208I

M1A3P600-PQG208I

IC FPGA 154 I/O 208QFP

Microchip Technology

2,570 53.86
M1A3P600-PQG208I

数据手册

ProASIC3 208-BFQFP Tray Active Not Verified - - 110592 154 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 208-PQFP (28x28)
M1A3P600-2FGG256

M1A3P600-2FGG256

IC FPGA 177 I/O 256FBGA

Microchip Technology

4,936 54.49
M1A3P600-2FGG256

数据手册

ProASIC3 256-LBGA Tray Active Not Verified - - 110592 177 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)
A3P600-2FG256

A3P600-2FG256

IC FPGA 177 I/O 256FBGA

Microchip Technology

3,906 54.49
A3P600-2FG256

数据手册

ProASIC3 256-LBGA Tray Active Not Verified - - 110592 177 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)
M1A3P600-2FG256

M1A3P600-2FG256

IC FPGA 177 I/O 256FBGA

Microchip Technology

3,721 54.49
M1A3P600-2FG256

数据手册

ProASIC3 256-LBGA Tray Active Not Verified - - 110592 177 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)