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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
M1A3P600-2FGG144I

M1A3P600-2FGG144I

IC FPGA 97 I/O 144FBGA

Microchip Technology

2,426 56.50
M1A3P600-2FGG144I

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 110592 97 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 144-FPBGA (13x13)
M1A3P600-2FG144I

M1A3P600-2FG144I

IC FPGA 97 I/O 144FBGA

Microchip Technology

3,611 56.50
M1A3P600-2FG144I

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 110592 97 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 144-FPBGA (13x13)
M1A3P600-FG484

M1A3P600-FG484

IC FPGA 235 I/O 484FBGA

Microchip Technology

2,911 56.54
M1A3P600-FG484

数据手册

ProASIC3 484-BGA Tray Active Not Verified - - 110592 235 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M1A3P600-FGG484

M1A3P600-FGG484

IC FPGA 235 I/O 484FBGA

Microchip Technology

1,912 56.54
M1A3P600-FGG484

数据手册

ProASIC3 484-BGA Tray Active Not Verified - - 110592 235 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
A54SX08A-FTQG144

A54SX08A-FTQG144

IC FPGA 113 I/O 144TQFP

Microchip Technology

3,676 57.38
A54SX08A-FTQG144

数据手册

SX-A 144-LQFP Tray Active Not Verified 768 - - 113 12000 2.25V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 144-TQFP (20x20)
A3P600-1FGG256I

A3P600-1FGG256I

IC FPGA 177 I/O 256FBGA

Microchip Technology

2,272 57.78
A3P600-1FGG256I

数据手册

ProASIC3 256-LBGA Tray Active Not Verified - - 110592 177 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
M1A3P600-1FGG256I

M1A3P600-1FGG256I

IC FPGA 177 I/O 256FBGA

Microchip Technology

2,783 57.78
M1A3P600-1FGG256I

数据手册

ProASIC3 256-LBGA Tray Active Not Verified - - 110592 177 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
M1A3P600-1FG256I

M1A3P600-1FG256I

IC FPGA 177 I/O 256FBGA

Microchip Technology

2,100 57.78
M1A3P600-1FG256I

数据手册

ProASIC3 256-LBGA Tray Active Not Verified - - 110592 177 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
A3P600-1FG256I

A3P600-1FG256I

IC FPGA 177 I/O 256FBGA

Microchip Technology

1,149 57.78
A3P600-1FG256I

数据手册

ProASIC3 256-LBGA Tray Active Not Verified - - 110592 177 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
AGL400V5-FGG256I

AGL400V5-FGG256I

IC FPGA 178 I/O 256FBGA

Microchip Technology

2,858 -
AGL400V5-FGG256I

数据手册

IGLOO 256-LBGA Tray Active Not Verified - 9216 55296 178 400000 1.425V ~ 1.575V Surface Mount -40°C ~ 85°C (TA) - - 256-FPBGA (17x17)