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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
M2GL025TS-1FCS325I

M2GL025TS-1FCS325I

IC FPGA 180 I/O 325BGA

Microchip Technology

1,224 67.06
M2GL025TS-1FCS325I

数据手册

IGLOO2 325-TFBGA, FCBGA Tray Active Not Verified - 27696 1130496 180 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 325-FCBGA (11x11)
M2GL025TS-1FCSG325I

M2GL025TS-1FCSG325I

IC FPGA 180 I/O 324CSBGA

Microchip Technology

3,467 67.06
M2GL025TS-1FCSG325I

数据手册

IGLOO2 325-TFBGA, FCBGA Tray Active Not Verified - 27696 1130496 180 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 325-FCBGA (11x11)
A3P600-1FGG484

A3P600-1FGG484

IC FPGA 235 I/O 484FBGA

Microchip Technology

4,592 61.81
A3P600-1FGG484

数据手册

ProASIC3 484-BGA Tray Active Not Verified - - 110592 235 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
A3P600-1FG484

A3P600-1FG484

IC FPGA 235 I/O 484FBGA

Microchip Technology

2,212 61.81
A3P600-1FG484

数据手册

ProASIC3 484-BGA Tray Active Not Verified - - 110592 235 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M1A3P600-1FG484

M1A3P600-1FG484

IC FPGA 235 I/O 484FBGA

Microchip Technology

4,283 61.81
M1A3P600-1FG484

数据手册

ProASIC3 484-BGA Tray Active Not Verified - - 110592 235 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M1A3P600-1FGG484

M1A3P600-1FGG484

IC FPGA 235 I/O 484FBGA

Microchip Technology

1,780 61.81
M1A3P600-1FGG484

数据手册

ProASIC3 484-BGA Tray Active Not Verified - - 110592 235 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M2GL025-1FG484

M2GL025-1FG484

IC FPGA 267 I/O 484FBGA

Microchip Technology

3,051 65.85
M2GL025-1FG484

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 27696 1130496 267 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M2GL025-1FGG484

M2GL025-1FGG484

IC FPGA 267 I/O 484FBGA

Microchip Technology

4,915 65.85
M2GL025-1FGG484

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 27696 1130496 267 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M2GL025-FG484I

M2GL025-FG484I

IC FPGA 267 I/O 484FBGA

Microchip Technology

2,424 65.85
M2GL025-FG484I

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 27696 1130496 267 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
M1A3P600-2FG256I

M1A3P600-2FG256I

IC FPGA 177 I/O 256FBGA

Microchip Technology

1,853 62.66
M1A3P600-2FG256I

数据手册

ProASIC3 256-LBGA Tray Active Not Verified - - 110592 177 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)