产品中心

制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
AGL400V2-FGG256I

AGL400V2-FGG256I

IC FPGA 178 I/O 256FBGA

Microchip Technology

1,040 -
AGL400V2-FGG256I

数据手册

IGLOO 256-LBGA Tray Active Not Verified - 9216 55296 178 400000 1.14V ~ 1.575V Surface Mount -40°C ~ 85°C (TA) - - 256-FPBGA (17x17)
A40MX02-1PLG44

A40MX02-1PLG44

IC FPGA 34 I/O 44PLCC

Microchip Technology

2,008 64.34
A40MX02-1PLG44

数据手册

MX 44-LCC (J-Lead) Tray Active Not Verified - - - 34 3000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 44-PLCC (16.59x16.59)
M1A3P600-FG484I

M1A3P600-FG484I

IC FPGA 235 I/O 484FBGA

Microchip Technology

4,102 65.01
M1A3P600-FG484I

数据手册

ProASIC3 484-BGA Tray Active Not Verified - - 110592 235 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
M1A3P600-FGG484I

M1A3P600-FGG484I

IC FPGA 235 I/O 484FBGA

Microchip Technology

1,918 65.01
M1A3P600-FGG484I

数据手册

ProASIC3 484-BGA Tray Active Not Verified - - 110592 235 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
A54SX16A-FTQG144

A54SX16A-FTQG144

IC FPGA 113 I/O 144TQFP

Microchip Technology

3,269 65.42
A54SX16A-FTQG144

数据手册

SX-A 144-LQFP Tray Active Not Verified 1452 - - 113 24000 2.25V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 144-TQFP (20x20)
A54SX16A-FTQG100

A54SX16A-FTQG100

IC FPGA 81 I/O 100TQFP

Microchip Technology

1,363 65.42
A54SX16A-FTQG100

数据手册

SX-A 100-LQFP Tray Active Not Verified 1452 - - 81 24000 2.25V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 100-TQFP (14x14)
M1A3P1000-FG144

M1A3P1000-FG144

IC FPGA 97 I/O 144FBGA

Microchip Technology

2,915 65.71

-

ProASIC3 144-LBGA Tray Active Not Verified - - 147456 97 1000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 144-FPBGA (13x13)
A3P1000-FG144

A3P1000-FG144

IC FPGA 97 I/O 144FBGA

Microchip Technology

1,950 65.71
A3P1000-FG144

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 147456 97 1000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 144-FPBGA (13x13)
M1A3P1000-FGG144

M1A3P1000-FGG144

IC FPGA 97 I/O 144FBGA

Microchip Technology

4,005 65.71

-

ProASIC3 144-LBGA Tray Active Not Verified - - 147456 97 1000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 144-FPBGA (13x13)
M1A3P600-2FGG484

M1A3P600-2FGG484

IC FPGA 235 I/O 484FBGA

Microchip Technology

2,881 67.09
M1A3P600-2FGG484

数据手册

ProASIC3 484-BGA Tray Active Not Verified - - 110592 235 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)