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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
A3P600-2FG484

A3P600-2FG484

IC FPGA 235 I/O 484FBGA

Microchip Technology

1,750 67.09
A3P600-2FG484

数据手册

ProASIC3 484-BGA Tray Active Not Verified - - 110592 235 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M1A3P600-2FG484

M1A3P600-2FG484

IC FPGA 235 I/O 484FBGA

Microchip Technology

3,106 67.09
M1A3P600-2FG484

数据手册

ProASIC3 484-BGA Tray Active Not Verified - - 110592 235 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
A40MX02-1PLG68

A40MX02-1PLG68

IC FPGA 57 I/O 68PLCC

Microchip Technology

2,838 67.66
A40MX02-1PLG68

数据手册

MX 68-LCC (J-Lead) Tray Active Not Verified - - - 57 3000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 68-PLCC (24.23x24.23)
M2GL025T-1FG484

M2GL025T-1FG484

IC FPGA 267 I/O 484FBGA

Microchip Technology

1,509 71.56
M2GL025T-1FG484

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 27696 1130496 267 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M2GL025T-1FGG484

M2GL025T-1FGG484

IC FPGA 267 I/O 484FBGA

Microchip Technology

3,855 71.56
M2GL025T-1FGG484

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 27696 1130496 267 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M2GL025T-FG484I

M2GL025T-FG484I

IC FPGA 267 I/O 484FBGA

Microchip Technology

1,745 71.56
M2GL025T-FG484I

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 27696 1130496 267 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
M2GL025TS-FG484

M2GL025TS-FG484

IC FPGA 267 I/O 484FBGA

Microchip Technology

4,162 71.56
M2GL025TS-FG484

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 27696 1130496 267 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M2GL025TS-FGG484

M2GL025TS-FGG484

IC FPGA 267 I/O 484FBGA

Microchip Technology

2,577 71.56
M2GL025TS-FGG484

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 27696 1130496 267 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M2GL050T-FCS325

M2GL050T-FCS325

IC FPGA 200 I/O 325BGA

Microchip Technology

3,400 73.62
M2GL050T-FCS325

数据手册

IGLOO2 325-TFBGA, FCBGA Tray Active Not Verified - 56340 1869824 200 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 325-FCBGA (11x11)
M2GL050T-FCSG325

M2GL050T-FCSG325

IC FPGA 200 I/O 324CSBGA

Microchip Technology

4,267 73.62
M2GL050T-FCSG325

数据手册

IGLOO2 325-TFBGA, FCBGA Tray Active Not Verified - 56340 1869824 200 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 325-FCBGA (11x11)