| 图片 | 制造商型号 | 库存情况 | 价格 | 库存 | 数据手册 | 封装/外壳 | 系列 | 包装 | 产品状态 | 可编程 | 核心处理器 | 核心大小 | 速度 | 连接性 | 外设 | I/O 数量 | 程序存储器大小 | 程序存储器类型 | EEPROM 大小 | RAM 大小 | 电压 - 供应（Vcc/Vdd） | 数据转换器 | 振荡器类型 | 工作温度 | 等级 | 认证 | 安装类型 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
LPC5504JBD64YIC MCU 32BIT 128KB FLASH 64HTQFP NXP USA Inc. |
1,065 | - |
|
数据手册 |
64-TQFP Exposed Pad | LPC550x | Tape & Reel (TR) | Active | - | ARM® Cortex®-M33 | 32-Bit Single-Core | 96MHz | CAN FD, Flexcomm, I2C, SPI, UART/USART | Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT | 45 | 128KB (128K x 8) | FLASH | - | 80K x 8 | 1.8V ~ 3.6V | A/D 9x16b SAR | External, Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount | |
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MC9S08SH4CTJIC MCU 8BIT 4KB FLASH 20TSSOP NXP USA Inc. |
2,133 | 3.91 |
|
数据手册 |
20-TSSOP (0.173", 4.40mm Width) | S08 | Tube | Active | Not Verified | S08 | 8-Bit | 40MHz | I2C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 17 | 4KB (4K x 8) | FLASH | - | 256 x 8 | 2.7V ~ 5.5V | A/D 12x10b | Internal | -40°C ~ 85°C (TA) | - | - | Surface Mount | |
|
MC9S08QG8CDTEIC MCU 8BIT 8KB FLASH 16TSSOP NXP USA Inc. |
5,975 | 4.10 |
|
数据手册 |
16-TSSOP (0.173", 4.40mm Width) | S08 | Tube | Active | Verified | S08 | 8-Bit | 20MHz | I2C, SCI, SPI | LVD, POR, PWM, WDT | 12 | 8KB (8K x 8) | FLASH | - | 512 x 8 | 1.8V ~ 3.6V | A/D 8x10b | Internal | -40°C ~ 85°C (TA) | - | - | Surface Mount | |
|
|
MC9S08SH8CTGIC MCU 8BIT 8KB FLASH 16TSSOP NXP USA Inc. |
3,730 | 4.11 |
|
数据手册 |
16-TSSOP (0.173", 4.40mm Width) | S08 | Tube | Active | Not Verified | S08 | 8-Bit | 40MHz | I2C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 13 | 8KB (8K x 8) | FLASH | - | 512 x 8 | 2.7V ~ 5.5V | A/D 8x10b | Internal | -40°C ~ 85°C (TA) | - | - | Surface Mount | |
|
MC9S08SH8CWJIC MCU 8BIT 8KB FLASH 20SOIC NXP USA Inc. |
1,712 | 4.11 |
|
数据手册 |
20-SOIC (0.295", 7.50mm Width) | S08 | Tube | Active | Not Verified | S08 | 8-Bit | 40MHz | I2C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 17 | 8KB (8K x 8) | FLASH | - | 512 x 8 | 2.7V ~ 5.5V | A/D 12x10b | Internal | -40°C ~ 85°C (TA) | - | - | Surface Mount | |
|
MKE02Z64VLH4IC MCU 32BIT 64KB FLASH 64LQFP NXP USA Inc. |
680 | 4.18 |
|
数据手册 |
64-LQFP | Kinetis KE02 | Tray | Active | Not Verified | ARM® Cortex®-M0+ | 32-Bit Single-Core | 40MHz | I2C, SPI, UART/USART | LVD, PWM, WDT | 57 | 64KB (64K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b; D/A 2x6b | Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount | |
|
LPC51U68JBD48KIC MCU 32BIT 256KB FLASH 48LQFP NXP USA Inc. |
990 | 4.21 |
|
数据手册 |
48-LQFP | LPC51U | Tray | Active | Not Verified | ARM® Cortex®-M0+ | 32-Bit Single-Core | 100MHz | USART, SPIs, I2C, USB | Brown-out Detect/Reset, POR, PWM, WDT, DMA | 37 | 256KB (256K x 8) | FLASH | 32K x 8 | 96K x 8 | 1.62V ~ 3.6V | A/D 12x12b SAR | Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount | |
|
MKE02Z64VQH4IC MCU 32BIT 64KB FLASH 64QFP NXP USA Inc. |
1,212 | 3.31 |
|
- |
64-QFP | Kinetis KE02 | Tray | Active | Not Verified | ARM® Cortex®-M0+ | 32-Bit Single-Core | 40MHz | I2C, SPI, UART/USART | LVD, PWM, WDT | 57 | 64KB (64K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b; D/A 2x6b | Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount | |
|
|
LPC1114FBD48/301,1IC MCU 32BIT 32KB FLASH 48LQFP NXP USA Inc. |
502 | 4.31 |
|
数据手册 |
48-LQFP | LPC1100 | Tray | Active | Not Verified | ARM® Cortex®-M0 | 32-Bit Single-Core | 50MHz | I2C, SPI, UART/USART | Brown-out Detect/Reset, POR, WDT | 42 | 32KB (32K x 8) | FLASH | - | 8K x 8 | 1.8V ~ 3.6V | A/D 8x10b | Internal | -40°C ~ 85°C (TA) | - | - | Surface Mount | |
|
|
MC9S08QE8CTGIC MCU 8BIT 8KB FLASH 16TSSOP NXP USA Inc. |
2,343 | 3.76 |
|
数据手册 |
16-TSSOP (0.173", 4.40mm Width) | S08 | Tube | Active | Verified | S08 | 8-Bit | 20MHz | I2C, LINbus, SCI, SPI | LVD, PWM, WDT | 12 | 8KB (8K x 8) | FLASH | - | 512 x 8 | 1.8V ~ 3.6V | A/D 8x12b | Internal | -40°C ~ 85°C (TA) | - | - | Surface Mount |
