| 图片 | 制造商型号 | 库存情况 | 价格 | 库存 | 数据手册 | 封装/外壳 | 系列 | 包装 | 产品状态 | 可编程 | 核心处理器 | 核心大小 | 速度 | 连接性 | 外设 | I/O 数量 | 程序存储器大小 | 程序存储器类型 | EEPROM 大小 | RAM 大小 | 电压 - 供应（Vcc/Vdd） | 数据转换器 | 振荡器类型 | 工作温度 | 等级 | 认证 | 安装类型 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MC9S08QD2CSCIC MCU 8BIT 2KB FLASH 8SOIC NXP USA Inc. |
6,853 | 2.72 |
|
数据手册 |
8-SOIC (0.154", 3.90mm Width) | S08 | Tube | Active | Not Verified | S08 | 8-Bit | 16MHz | - | LVD, POR, PWM, WDT | 4 | 2KB (2K x 8) | FLASH | - | 128 x 8 | 2.7V ~ 5.5V | A/D 4x10b | Internal | -40°C ~ 85°C (TA) | - | - | Surface Mount | |
|
MKL02Z8VFG4IC MCU 32BIT 8KB FLASH 16QFN NXP USA Inc. |
2,079 | 2.78 |
|
数据手册 |
16-UFQFN Exposed Pad | Kinetis KL02 | Tray | Active | Not Verified | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I2C, SPI, UART/USART | Brown-out Detect/Reset, LVD, POR, PWM, WDT | 14 | 8KB (8K x 8) | FLASH | - | 1K x 8 | 1.71V ~ 3.6V | A/D 6x12b | Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount | |
|
LPC1111FHN33/101,5IC MCU 32BIT 8KB FLASH 32HVQFN NXP USA Inc. |
238 | 2.83 |
|
数据手册 |
32-VQFN Exposed Pad | LPC1100 | Tray | Active | Not Verified | ARM® Cortex®-M0 | 32-Bit Single-Core | 50MHz | I2C, SPI, UART/USART | Brown-out Detect/Reset, POR, WDT | 28 | 8KB (8K x 8) | FLASH | - | 2K x 8 | 1.8V ~ 3.6V | A/D 8x10b | Internal | -40°C ~ 85°C (TA) | - | - | Surface Mount | |
|
LPC8N04FHI24ZIC MCU 32BIT 32KB FLASH 24HVQFN NXP USA Inc. |
1,460 | 1.39 |
|
数据手册 |
24-VFQFN Exposed Pad | LPC8Nxx | Tape & Reel (TR) | Active | Not Verified | ARM® Cortex®-M0+ | 32-Bit Single-Core | 8MHz | I2C, SPI | Brown-out Detect/Reset, POR, PWM, WDT | 12 | 32KB (32K x 8) | FLASH | 4K x 8 | 8K x 8 | 1.72V ~ 3.6V | - | Internal | -40°C ~ 85°C (TA) | - | - | Surface Mount | |
|
LPC8N04FHI24EIC MCU 32BIT 32KB FLASH 24HVQFN NXP USA Inc. |
305 | 2.46 |
|
数据手册 |
24-VFQFN Exposed Pad | LPC8Nxx | Tray | Active | Not Verified | ARM® Cortex®-M0+ | 32-Bit Single-Core | 8MHz | I2C, SPI | Brown-out Detect/Reset, POR, PWM, WDT | 12 | 32KB (32K x 8) | FLASH | 4K x 8 | 8K x 8 | 1.72V ~ 3.6V | - | Internal | -40°C ~ 85°C (TA) | - | - | Surface Mount | |
|
|
MKL02Z16VFG4IC MCU 32BIT 16KB FLASH 16QFN NXP USA Inc. |
2,192 | 2.87 |
|
数据手册 |
16-UFQFN Exposed Pad | Kinetis KL02 | Tray | Active | Not Verified | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I2C, SPI, UART/USART | Brown-out Detect/Reset, LVD, POR, PWM, WDT | 14 | 16KB (16K x 8) | FLASH | - | 2K x 8 | 1.71V ~ 3.6V | A/D 6x12b | Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount | |
|
LPC844M201JHI48EIC MCU 32BIT 64KB FLASH 48HVQFN NXP USA Inc. |
122 | 2.88 |
|
数据手册 |
48-VFQFN Exposed Pad | LPC84x | Tray | Active | Not Verified | ARM® Cortex®-M0+ | 32-Bit Single-Core | 30MHz | I2C, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 42 | 64KB (64K x 8) | FLASH | - | 8K x 8 | 1.8V ~ 3.6V | A/D 12x12b | External, Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount | |
|
MC9S08QE8CWJIC MCU 8BIT 8KB FLASH 20SOIC NXP USA Inc. |
1,046 | 4.70 |
|
数据手册 |
20-SOIC (0.295", 7.50mm Width) | S08 | Tube | Active | Not Verified | S08 | 8-Bit | 20MHz | I2C, LINbus, SCI, SPI | LVD, PWM, WDT | 16 | 8KB (8K x 8) | FLASH | - | 512 x 8 | 1.8V ~ 3.6V | A/D 8x12b | Internal | -40°C ~ 85°C (TA) | - | - | Surface Mount | |
|
LPC845M301JBD48EIC MCU 32BIT 64KB FLASH 48LQFP NXP USA Inc. |
4,963 | 3.03 |
|
数据手册 |
48-LQFP | LPC84x | Tray | Active | Not Verified | ARM® Cortex®-M0+ | 32-Bit Single-Core | 30MHz | I2C, SPI, UART/USART | Brown-out Detect/Reset, Capacitive Touch, DMA, POR, PWM, WDT | 42 | 64KB (64K x 8) | FLASH | - | 16K x 8 | 1.8V ~ 3.6V | A/D 12x12b; D/A 2x10b | External, Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount | |
|
MC9S08PA32VLHIC MCU 8BIT 32KB FLASH 64LQFP NXP USA Inc. |
750 | 4.07 |
|
- |
64-LQFP | S08 | Tray | Not For New Designs | Not Verified | S08 | 8-Bit | 20MHz | I2C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 57 | 32KB (32K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b | Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount |
