| 图片 | 制造商型号 | 库存情况 | 价格 | 库存 | 数据手册 | 封装/外壳 | 系列 | 包装 | 产品状态 | 可编程 | 核心处理器 | 核心大小 | 速度 | 连接性 | 外设 | I/O 数量 | 程序存储器大小 | 程序存储器类型 | EEPROM 大小 | RAM 大小 | 电压 - 供应（Vcc/Vdd） | 数据转换器 | 振荡器类型 | 工作温度 | 等级 | 认证 | 安装类型 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MC68L11E1FNE2IC MCU 8BIT ROMLESS 52PLCC NXP USA Inc. |
1,830 | - |
|
数据手册 |
52-LCC (J-Lead) | HC11 | Tube | Obsolete | Not Verified | HC11 | 8-Bit | 2MHz | SCI, SPI | POR, WDT | 38 | - | ROMless | 512 x 8 | 512 x 8 | 3V ~ 5.5V | A/D 8x8b | Internal | 0°C ~ 70°C (TA) | - | - | Surface Mount | |
|
MC68L11F1CFNE3IC MCU 8BIT ROMLESS 68PLCC NXP USA Inc. |
2,896 | 26.18 |
|
数据手册 |
68-LCC (J-Lead) | HC11 | Tube | Obsolete | Not Verified | HC11 | 8-Bit | 3MHz | SCI, SPI | POR, WDT | 30 | - | ROMless | 512 x 8 | 1K x 8 | 3V ~ 5.5V | A/D 8x8b | Internal | -40°C ~ 85°C (TA) | - | - | Surface Mount | |
|
MC705C8ACFBEIC MCU 8BIT 8KB OTP 44QFP NXP USA Inc. |
3,990 | 9.05 |
|
- |
44-QFP | HC05 | Tray | Obsolete | Not Verified | HC05 | 8-Bit | 2.1MHz | SCI, SPI | POR, WDT | 24 | 8KB (8K x 8) | OTP | - | 304 x 8 | 3V ~ 5.5V | - | Internal | -40°C ~ 85°C (TA) | - | - | Surface Mount | |
|
MC705J1ACDWEIC MCU 8BIT 1.2KB OTP 20SOIC NXP USA Inc. |
2,264 | - |
|
数据手册 |
20-SOIC (0.295", 7.50mm Width) | HC05 | Tube | Obsolete | Not Verified | HC05 | 8-Bit | 4MHz | - | POR, WDT | 14 | 1.2KB (1.2K x 8) | OTP | - | 64 x 8 | 3V ~ 5.5V | - | Internal | -40°C ~ 85°C (TA) | - | - | Surface Mount | |
|
MC908GZ60MFJEIC MCU 8BIT 60KB FLASH 32LQFP NXP USA Inc. |
2,350 | 8.72 |
|
数据手册 |
32-LQFP | HC08 | Tray | Obsolete | Not Verified | HC08 | 8-Bit | 8MHz | CANbus, SCI, SPI | LVD, POR, PWM | 21 | 60KB (60K x 8) | FLASH | - | 2K x 8 | 3V ~ 5.5V | A/D 24x10b | Internal | -40°C ~ 125°C (TA) | - | - | Surface Mount | |
|
|
MCHC11F1CFNE3IC MCU 8BIT ROMLESS 68PLCC NXP USA Inc. |
3,958 | 26.82 |
|
数据手册 |
68-LCC (J-Lead) | HC11 | Tube | Obsolete | Not Verified | HC11 | 8-Bit | 3MHz | SCI, SPI | POR, WDT | 30 | - | ROMless | 512 x 8 | 1K x 8 | 4.75V ~ 5.25V | A/D 8x8b | Internal | -40°C ~ 85°C (TA) | - | - | Surface Mount | |
|
|
MCHC11F1CFNE4IC MCU 8BIT ROMLESS 68PLCC NXP USA Inc. |
3,742 | 28.07 |
|
数据手册 |
68-LCC (J-Lead) | HC11 | Tube | Obsolete | Not Verified | HC11 | 8-Bit | 4MHz | SCI, SPI | POR, WDT | 30 | - | ROMless | 512 x 8 | 1K x 8 | 4.75V ~ 5.25V | A/D 8x8b | Internal | -40°C ~ 85°C (TA) | - | - | Surface Mount | |
|
|
MCHC11F1CFNE4RIC MCU 8BIT ROMLESS 68PLCC NXP USA Inc. |
1,834 | 28.07 |
|
数据手册 |
68-LCC (J-Lead) | HC11 | Tape & Reel (TR) | Obsolete | Not Verified | HC11 | 8-Bit | 4MHz | SCI, SPI | POR, WDT | 30 | - | ROMless | 512 x 8 | 1K x 8 | 4.75V ~ 5.25V | A/D 8x8b | Internal | -40°C ~ 85°C (TA) | - | - | Surface Mount | |
|
MCHC705JJ7CPEIC MCU 8BIT 6KB OTP 20DIP NXP USA Inc. |
4,947 | 4.82 |
|
数据手册 |
20-DIP (0.300", 7.62mm) | HC05 | Tube | Obsolete | Not Verified | HC05 | 8-Bit | 2.1MHz | SIO | POR, Temp Sensor, WDT | 14 | 6KB (6K x 8) | OTP | - | 224 x 8 | 2.7V ~ 5.5V | A/D 4x12b | Internal | -40°C ~ 85°C (TA) | - | - | Through Hole | |
|
MCHC705KJ1CDWEIC MCU 8BIT 1.2KB OTP 16SOIC NXP USA Inc. |
2,232 | - |
|
数据手册 |
16-SOIC (0.295", 7.50mm Width) | HC05 | Tube | Obsolete | Not Verified | HC05 | 8-Bit | 4MHz | - | POR, WDT | 10 | 1.2KB (1.2K x 8) | OTP | - | 64 x 8 | 3V ~ 5.5V | - | Internal | -40°C ~ 85°C (TA) | - | - | Surface Mount |
