图片 | 制造商型号 | 库存情况 | 价格 | 库存 | 数据手册 | 系列 | 封装/外壳 | 包装 | 产品状态 | 架构 | 核心处理器 | 闪存大小 | RAM 大小 | 外设 | 连接性 | 速度 | 主要属性 | 工作温度 | 等级 | 认证 | 供应商设备封装 |
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M2S090T-FCS325IC SOC CORTEX-M3 166MHZ 325BGA Microchip Technology |
3,361 | 140.22 |
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![]() 数据手册 |
SmartFusion®2 | 325-TFBGA, FCBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 90K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 325-FCBGA (11x13.5) |
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M2S090T-FCSG325IC SOC CORTEX-M3 166MHZ 325BGA Microchip Technology |
2,352 | 140.22 |
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![]() 数据手册 |
SmartFusion®2 | 325-TFBGA, FCBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 90K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 325-FCBGA (11x13.5) |
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M2S060T-1FG676IC SOC CORTEX-M3 166MHZ 676FBGA Microchip Technology |
1,609 | 141.86 |
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![]() 数据手册 |
SmartFusion®2 | 676-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 60K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 676-FBGA (27x27) |
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M2S060T-FG676IIC SOC CORTEX-M3 166MHZ 676FBGA Microchip Technology |
1,063 | 141.86 |
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![]() 数据手册 |
SmartFusion®2 | 676-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 60K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 676-FBGA (27x27) |
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M2S060T-FGG676IIC SOC CORTEX-M3 166MHZ 676FBGA Microchip Technology |
3,488 | 141.86 |
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![]() 数据手册 |
SmartFusion®2 | 676-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 60K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 676-FBGA (27x27) |
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M2S060TS-FG676IC SOC CORTEX-M3 166MHZ 676FBGA Microchip Technology |
1,251 | 141.86 |
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![]() 数据手册 |
SmartFusion®2 | 676-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 60K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 676-FBGA (27x27) |
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M2S060TS-FGG676IC SOC CORTEX-M3 166MHZ 676FBGA Microchip Technology |
2,792 | 141.86 |
|
![]() 数据手册 |
SmartFusion®2 | 676-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 60K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 676-FBGA (27x27) |
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M2S060T-1FGG676IC SOC CORTEX-M3 166MHZ 676FBGA Microchip Technology |
1,207 | 141.86 |
|
![]() 数据手册 |
SmartFusion®2 | 676-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 60K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 676-FBGA (27x27) |
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M2S050T-1FG484IIC SOC CORTEX-M3 166MHZ 484FBGA Microchip Technology |
4,660 | 142.90 |
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![]() 数据手册 |
SmartFusion®2 | 484-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 50K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 484-FPBGA (23x23) |
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M2S050T-1FGG484IIC SOC CORTEX-M3 166MHZ 484FBGA Microchip Technology |
2,681 | 142.90 |
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![]() 数据手册 |
SmartFusion®2 | 484-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 50K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 484-FPBGA (23x23) |