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图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 I/O 数量 接口 中断输出 特性 输出类型 电流 - 输出源/汇 时钟频率 电压 - 电源 工作温度 等级 认证 安装类型 供应商设备封装
MCP23S08T-E/SS

MCP23S08T-E/SS

IC XPNDR 10MHZ SPI 20SSOP

Microchip Technology

10,536 1.25
MCP23S08T-E/SS

数据手册

- 20-SSOP (0.209", 5.30mm Width) Tape & Reel (TR) Active Not Verified 8 SPI Yes POR Push-Pull 25mA 10 MHz 1.8V ~ 5.5V -40°C ~ 125°C - - Surface Mount 20-SSOP
MCP23S08-E/SS

MCP23S08-E/SS

IC XPNDR 10MHZ SPI 20SSOP

Microchip Technology

2,304 1.25
MCP23S08-E/SS

数据手册

- 20-SSOP (0.209", 5.30mm Width) Tube Active Not Verified 8 SPI Yes POR Push-Pull 25mA 10 MHz 1.8V ~ 5.5V -40°C ~ 125°C - - Surface Mount 20-SSOP
MCP23017T-E/SO

MCP23017T-E/SO

IC XPNDR 1.7MHZ I2C 28SOIC

Microchip Technology

11,036 1.30
MCP23017T-E/SO

数据手册

- 28-SOIC (0.295", 7.50mm Width) Tape & Reel (TR) Active Not Verified 16 I2C Yes POR Push-Pull 25mA 1.7 MHz 1.8V ~ 5.5V -40°C ~ 125°C - - Surface Mount 28-SOIC
MCP23017-E/SO

MCP23017-E/SO

IC XPNDR 1.7MHZ I2C 28SOIC

Microchip Technology

3,308 1.30
MCP23017-E/SO

数据手册

- 28-SOIC (0.295", 7.50mm Width) Tube Active Not Verified 16 I2C Yes POR Push-Pull 25mA 1.7 MHz 1.8V ~ 5.5V -40°C ~ 125°C - - Surface Mount 28-SOIC
MCP23009-E/MG

MCP23009-E/MG

IC XPNDR 3.4MHZ I2C 16QFN

Microchip Technology

5,033 1.30
MCP23009-E/MG

数据手册

- 16-VFQFN Exposed Pad Tube Active Not Verified 8 I2C Yes POR Open Drain 25mA 3.4 MHz 1.8V ~ 5.5V -40°C ~ 125°C - - Surface Mount 16-QFN (3x3)
MCP23S08T-E/ML

MCP23S08T-E/ML

IC XPNDR 10MHZ SPI 20QFN

Microchip Technology

12,065 1.32
MCP23S08T-E/ML

数据手册

- 20-VFQFN Exposed Pad Tape & Reel (TR) Active Not Verified 8 SPI Yes POR Push-Pull 25mA 10 MHz 1.8V ~ 5.5V -40°C ~ 125°C - - Surface Mount 20-QFN (4x4)
MCP23S08-E/ML

MCP23S08-E/ML

IC XPNDR 10MHZ SPI 20QFN

Microchip Technology

3,195 1.32
MCP23S08-E/ML

数据手册

- 20-VFQFN Exposed Pad Tube Active Not Verified 8 SPI Yes POR Push-Pull 25mA 10 MHz 1.8V ~ 5.5V -40°C ~ 125°C - - Surface Mount 20-QFN (4x4)
MCP23S17-E/SO

MCP23S17-E/SO

IC XPNDR 10MHZ SPI 28SOIC

Microchip Technology

6,718 1.36
MCP23S17-E/SO

数据手册

- 28-SOIC (0.295", 7.50mm Width) Tube Active Not Verified 16 SPI Yes POR Push-Pull 25mA 10 MHz 1.8V ~ 5.5V -40°C ~ 125°C - - Surface Mount 28-SOIC
MCP23017-E/SP

MCP23017-E/SP

IC XPNDR 1.7MHZ I2C 28SDIP

Microchip Technology

4,876 1.36
MCP23017-E/SP

数据手册

- 28-DIP (0.300", 7.62mm) Tube Active Not Verified 16 I2C Yes POR Push-Pull 25mA 1.7 MHz 1.8V ~ 5.5V -40°C ~ 125°C - - Through Hole 28-SPDIP
MCP23017-E/SS

MCP23017-E/SS

IC XPNDR 1.7MHZ I2C 28SSOP

Microchip Technology

4,474 1.36
MCP23017-E/SS

数据手册

- 28-SSOP (0.209", 5.30mm Width) Tube Active Not Verified 16 I2C Yes POR Push-Pull 25mA 1.7 MHz 1.8V ~ 5.5V -40°C ~ 125°C - - Surface Mount 28-SSOP