产品中心

制造商 系列 封装/外壳 包装 产品状态 应用 电流 - 电源 电压 - 电源 工作温度 等级 认证 安装类型 供应商设备封装
































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 应用 电流 - 电源 电压 - 电源 工作温度 等级 认证 安装类型 供应商设备封装
MC32PF3001A5EPR2

MC32PF3001A5EPR2

POWER MANAGEMENT IC I.MX7 PRE-

NXP USA Inc.

4,720 3.22
MC32PF3001A5EPR2

数据手册

- 48-VFQFN Exposed Pad Tape & Reel (TR) Active Processor - 2.8V ~ 5.5V -40°C ~ 85°C - - Surface Mount 48-HVQFN (7x7)
LTC1699EGN-82#TRPBF

LTC1699EGN-82#TRPBF

IC PROGRAMMER VOLT SMBUS 16SSOP

Analog Devices Inc.

2,303 3.35
LTC1699EGN-82#TRPBF

数据手册

- 16-SSOP (0.154", 3.90mm Width) Tape & Reel (TR) Active Processor 350µA 2.7V ~ 5.5V -40°C ~ 85°C - - Surface Mount 16-SSOP
LTC1699EGN-81#TRPBF

LTC1699EGN-81#TRPBF

IC PROGRAMMER VOLT SMBUS 16SSOP

Analog Devices Inc.

4,355 3.35
LTC1699EGN-81#TRPBF

数据手册

- 16-SSOP (0.154", 3.90mm Width) Tape & Reel (TR) Active Processor 350µA 2.7V ~ 5.5V -40°C ~ 85°C - - Surface Mount 16-SSOP
LTC1699EGN-80#TRPBF

LTC1699EGN-80#TRPBF

IC PROGRAMMER VOLT SMBUS 16SSOP

Analog Devices Inc.

1,866 3.35
LTC1699EGN-80#TRPBF

数据手册

- 16-SSOP (0.154", 3.90mm Width) Tape & Reel (TR) Active Processor 350µA 2.7V ~ 5.5V -40°C ~ 85°C - - Surface Mount 16-SSOP
MC33PF3001A6ES

MC33PF3001A6ES

POWER MANAGEMENT IC I.MX7 PRE-

NXP USA Inc.

2,929 3.43
MC33PF3001A6ES

数据手册

- 48-VFQFN Exposed Pad Tray Active Processor - 2.8V ~ 5.5V -40°C ~ 85°C - - Surface Mount 48-HVQFN (7x7)
MC33PF3001A7ES

MC33PF3001A7ES

POWER MANAGEMENT IC I.MX7 PRE-

NXP USA Inc.

2,450 3.43
MC33PF3001A7ES

数据手册

- 48-VFQFN Exposed Pad Tray Active Processor - 2.8V ~ 5.5V -40°C ~ 85°C - - Surface Mount 48-HVQFN (7x7)
MFS2305BMBA0EP

MFS2305BMBA0EP

MFS2305BMBA0EP

NXP USA Inc.

2,462 -
MFS2305BMBA0EP

数据手册

- 48-VFQFN Exposed Pad Bulk Active System Basis Chip - 3.3V, 5V -40°C ~ 120°C - - Surface Mount, Wettable Flank 48-HVQFN (7x7)
MPF5020AVNA0ES

MPF5020AVNA0ES

PF5020

NXP USA Inc.

3,963 2.53

-

- 40-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based 10µA 2.5V ~ 5.5V -40°C ~ 125°C (TA) - - Surface Mount, Wettable Flank 40-HVQFN (6x6)
MFS2325BMBA0EPR2

MFS2325BMBA0EPR2

MFS2325BMBA0EPR2

NXP USA Inc.

3,426 -
MFS2325BMBA0EPR2

数据手册

- 48-VFQFN Exposed Pad Bulk Active System Basis Chip - 3.3V, 5V -40°C ~ 120°C - - Surface Mount, Wettable Flank 48-HVQFN (7x7)
MC33912BAC

MC33912BAC

IC SYSTEM BASIS CHIP 32LQFP

NXP USA Inc.

4,245 2.46
MC33912BAC

数据手册

- 32-LQFP Tray Active System Basis Chip 4.5mA 5.5V ~ 27V -40°C ~ 125°C - - Surface Mount 32-LQFP (7x7)
MFS2325BMMA0EP

MFS2325BMMA0EP

MFS2325BMMA0EP

NXP USA Inc.

1,944 -
MFS2325BMMA0EP

数据手册

- 48-VFQFN Exposed Pad Bulk Active System Basis Chip - 3.3V, 5V -40°C ~ 120°C - - Surface Mount, Wettable Flank 48-HVQFN (7x7)
PCA9452AHNMP

PCA9452AHNMP

PCA9452AHNMP

NXP USA Inc.

1,106 -
PCA9452AHNMP

数据手册

- 56-VFQFN Exposed Pad Bulk Active Processor - - -40°C ~ 105°C (TA) - - Surface Mount 56-HVQFN-EP (8x8)
MFS8620BMBA0ESR2

MFS8620BMBA0ESR2

SAFETY SYSTEM BASIS CHIP FOR DOM

NXP USA Inc.

4,569 -
MFS8620BMBA0ESR2

数据手册

- 48-VFQFN Exposed Pad Tape & Reel (TR) Active Camera - 36V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 48-HVQFN (7x7)
MPF5020CVNA0ESR2

MPF5020CVNA0ESR2

POWER MANAGEMENT IC, PRE-PROG, 3

NXP USA Inc.

1,918 -
MPF5020CVNA0ESR2

数据手册

- 40-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - - - Automotive AEC-Q100 Surface Mount, Wettable Flank 40-HVQFN (6x6)
MPF5020CMMA0ESR2

MPF5020CMMA0ESR2

POWER MANAGEMENT IC, PRE-PROG, 3

NXP USA Inc.

1,017 -
MPF5020CMMA0ESR2

数据手册

- 40-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - - - Automotive AEC-Q100 Surface Mount, Wettable Flank 40-HVQFN (6x6)
MPF5020AVNA0ESR2

MPF5020AVNA0ESR2

POWER MANAGEMENT IC, PRE-PROG, 3

NXP USA Inc.

2,332 -

-

- 40-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based 10µA 2.5V ~ 5.5V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 40-HVQFN (6x6)
MPF5020CMMACESR2

MPF5020CMMACESR2

POWER MANAGEMENT IC, PRE-PROG, 3

NXP USA Inc.

3,609 -
MPF5020CMMACESR2

数据手册

- - Tape & Reel (TR) Active - - - - - - - -
MPF5020AMMA0ESR2

MPF5020AMMA0ESR2

POWER MANAGEMENT IC, PRE-PROG, 3

NXP USA Inc.

2,050 -

-

- 40-VFQFN Exposed Pad Tape & Reel (TR) Active Microcontroller, MCU 40µA 2.7V ~ 5.5V -40°C ~ 150°C (TJ) - - Surface Mount, Wettable Flank 40-HVQFN (6x6)
LP3972SQ-I514

LP3972SQ-I514

IC PMU FOR APP PROCESSOR 40WQFN

Texas Instruments

4,960 -
LP3972SQ-I514

数据手册

- 40-WFQFN Exposed Pad Tape & Reel (TR) Obsolete Processor 60µA 2.7V ~ 5.5V -40°C ~ 85°C - - Surface Mount 40-WQFN (5x5)
TPS6591287YFFR

TPS6591287YFFR

IC POWER

Texas Instruments

2,803 3.38

-

- 81-UFBGA, DSBGA Tape & Reel (TR) Active Processor 8mA 2.7V ~ 5.5V -40°C ~ 105°C - - Surface Mount 81-DSBGA (3.6x3.6)