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图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 应用 电流 - 电源 电压 - 电源 工作温度 等级 认证 安装类型 供应商设备封装
MC33816AE

MC33816AE

IC SOLENOID CTRLR PROGRAMMABLE

NXP USA Inc.

2,286 -

-

- 64-LQFP Exposed Pad Tray Active Solenoid Controller - - -40°C ~ 125°C - - Surface Mount 64-LQFP (10x10)
MC33FS6526NAE

MC33FS6526NAE

SYSTEM BASIS CHIP, DCDC 2.2A VCO

NXP USA Inc.

3,319 -
MC33FS6526NAE

数据手册

- 48-LQFP Exposed Pad Tray Active System Basis Chip - 2.7V ~ 40V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MPF7100BMBA0ESR2

MPF7100BMBA0ESR2

POWER MANAGEMENT IC, I.MX 8, I.M

NXP USA Inc.

4,741 -
MPF7100BMBA0ESR2

数据手册

- 48-VFQFN Exposed Pad Tape & Reel (TR) Active i.MX Processors 10µA 2.5V ~ 5.5V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 48-HVQFN (7x7)
MC34PF8100CFEPR2

MC34PF8100CFEPR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

4,745 5.73
MC34PF8100CFEPR2

数据手册

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC34PF8100CCEPR2

MC34PF8100CCEPR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

4,503 6.59
MC34PF8100CCEPR2

数据手册

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC34PF8100A0EPR2

MC34PF8100A0EPR2

POWER MANAGEMENT IC I.MX8 NON-PR

NXP USA Inc.

3,282 5.73
MC34PF8100A0EPR2

数据手册

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC34PF8100F3EPR2

MC34PF8100F3EPR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

1,902 5.73
MC34PF8100F3EPR2

数据手册

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC34PF8100CHEPR2

MC34PF8100CHEPR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

2,663 5.12
MC34PF8100CHEPR2

数据手册

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC34PF8100EPEPR2

MC34PF8100EPEPR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

2,611 5.73
MC34PF8100EPEPR2

数据手册

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC34PF8100EREPR2

MC34PF8100EREPR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

4,065 5.73
MC34PF8100EREPR2

数据手册

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC34PF8100EQEPR2

MC34PF8100EQEPR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

3,494 5.73
MC34PF8100EQEPR2

数据手册

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
BQ501210RGCR

BQ501210RGCR

WIRELESS POWER MEDIUM POWER TRAN

Texas Instruments

4,274 5.32
BQ501210RGCR

数据手册

- 64-VFQFN Exposed Pad Tape & Reel (TR) Not For New Designs Wireless Power Transmitter 52mA 3V ~ 3.6V -40°C ~ 85°C - - Surface Mount 64-VQFN (9x9)
MC35FS4505CAE

MC35FS4505CAE

SYSTEM BASIS CHIP, LINEAR 0.5A V

NXP USA Inc.

1,890 -
MC35FS4505CAE

数据手册

- 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC35FS6501NAER2

MC35FS6501NAER2

FS6500

NXP USA Inc.

3,474 5.02
MC35FS6501NAER2

数据手册

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
STWBC-EPTR

STWBC-EPTR

IND.& POWER CONV.

STMicroelectronics

1,485 -
STWBC-EPTR

数据手册

- 32-VFQFN Exposed Pad Tape & Reel (TR) Obsolete Digital Power Controller - 3V ~ 5.5V -40°C ~ 105°C - - Surface Mount 32-VFQFPN (5x5)
MC33FS6506CAE

MC33FS6506CAE

SYSTEM BASIS CHIP, DCDC 0.8A VCO

NXP USA Inc.

4,004 -
MC33FS6506CAE

数据手册

- 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC33FS4502CAE

MC33FS4502CAE

SYSTEM BASIS CHIP LINEAR 0.5A V

NXP USA Inc.

2,563 5.03
MC33FS4502CAE

数据手册

- 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C - - Surface Mount 48-HLQFP (7x7)
MC33FS6522NAE

MC33FS6522NAE

SYSTEM BASIS CHIP DCDC 2.2A VCO

NXP USA Inc.

3,805 5.03
MC33FS6522NAE

数据手册

- 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C - - Surface Mount 48-HLQFP (7x7)
MFS2623AMBA0AD

MFS2623AMBA0AD

SAFETY SYSTEM BASIS CHIP WITH LO

NXP USA Inc.

2,334 -
MFS2623AMBA0AD

数据手册

- 48-LQFP Exposed Pad Tray Active - - 3.2V ~ 40V -40°C ~ 125°C (TA) Automotive - Surface Mount 48-LQFP-EP (7x7)
MFS2630AMDA0AD

MFS2630AMDA0AD

SAFETY SYSTEM BASIS CHIP WITH LO

NXP USA Inc.

3,258 -
MFS2630AMDA0AD

数据手册

- 48-LQFP Exposed Pad Tray Active - 29µA 3.2V ~ 40V -40°C ~ 125°C (TA) Automotive - Surface Mount 48-LQFP-EP (7x7)