图片 | 制造商型号 | 库存情况 | 价格 | 库存 | 数据手册 | 系列 | 封装/外壳 | 包装 | 产品状态 | 应用 | 电流 - 电源 | 电压 - 电源 | 工作温度 | 等级 | 认证 | 安装类型 | 供应商设备封装 |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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MC33FS8430G2ESSYSTEM BASIS CHIP FS8430 |
2,972 | 5.52 |
|
- |
* | - | Tray | Active | - | - | - | - | - | - | - | - |
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MC33FS8430G4ESSYSTEM BASIS CHIP FS8430 |
2,005 | 5.52 |
|
- |
* | - | Tray | Active | - | - | - | - | - | - | - | - |
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MC33PF8200DEESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
4,111 | 7.55 |
|
![]() 数据手册 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8200D2ESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
1,542 | 6.66 |
|
![]() 数据手册 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8200DBESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
2,374 | 6.66 |
|
![]() 数据手册 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8200EMESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
2,245 | 6.66 |
|
![]() 数据手册 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8200ETESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
3,104 | 6.66 |
|
![]() 数据手册 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8200A0ESR2POWER MANAGEMENT IC I.MX8 NON-PR |
3,784 | 6.66 |
|
![]() 数据手册 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8200DNESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
4,610 | 6.66 |
|
![]() 数据手册 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8200DMESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
2,699 | 6.66 |
|
![]() 数据手册 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8200DFESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
2,666 | 6.66 |
|
![]() 数据手册 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8200DHESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
4,231 | 6.66 |
|
![]() 数据手册 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8200ESESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
4,160 | 6.66 |
|
![]() 数据手册 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8200CXESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
3,107 | 6.66 |
|
![]() 数据手册 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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UCD9240RGCRIC DGTL PWM SYSTEM CTRLR 64VQFN |
2,056 | 6.12 |
|
![]() 数据手册 |
Fusion Digital Power™ | 64-VFQFN Exposed Pad | Tape & Reel (TR) | Active | Special Purpose | - | 3V ~ 3.6V | -40°C ~ 110°C | - | - | Surface Mount | 64-VQFN (9x9) |
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TWL6032A2B6YFFTIC PWR/BATT MGMT 155DSBGA |
3,957 | - |
|
![]() 数据手册 |
- | 155-UFBGA, DSBGA | Tape & Reel (TR) | Discontinued at Digi-Key | Handheld/Mobile Devices, OMAP™ | 20µA | 2.5V ~ 4.8V | -40°C ~ 85°C | - | - | Surface Mount | 155-DSBGA (5.21x5.36) |
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MC35FS6512CAER2FS6500 |
4,620 | 5.84 |
|
![]() 数据手册 |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
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MC35FS4501CAEFS4500 |
2,228 | 5.85 |
|
![]() 数据手册 |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
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MC35FS6501CAEFS6500 |
4,281 | 5.87 |
|
![]() 数据手册 |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
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MC34PF8100FJEPPOWER MANAGEMENT IC, I.MX8, PRE- |
1,722 | - |
|
![]() 数据手册 |
- | 56-VFQFN Exposed Pad | Tray | Active | Processor | 10µA | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |