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图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 应用 电流 - 电源 电压 - 电源 工作温度 等级 认证 安装类型 供应商设备封装
MC33SB0400ESR2

MC33SB0400ESR2

LOW SIDE DRIVER X4, WHEEL SPEED

NXP USA Inc.

1,826 -
MC33SB0400ESR2

数据手册

- 48-VFQFN Exposed Pad Tape & Reel (TR) Active Motorcycle Braking 10mA 3.3V, 5V -40°C ~ 125°C (TA) - - Surface Mount, Wettable Flank 48-HVQFN (7x7)
MC35FS6512CAE

MC35FS6512CAE

FS6500

NXP USA Inc.

1,457 6.28
MC35FS6512CAE

数据手册

- 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
LTC3109IGN#TRPBF

LTC3109IGN#TRPBF

IC BOOST CONVERTER PMU 20SSOP

Analog Devices Inc.

1,116 6.65
LTC3109IGN#TRPBF

数据手册

- 20-SSOP (0.154", 3.90mm Width) Tape & Reel (TR) Active Energy Harvesting 6mA 30mV ~ 500mV -40°C ~ 125°C - - Surface Mount 20-SSOP
LTC3109IUF#TRPBF

LTC3109IUF#TRPBF

IC BOOST CONVERTER PMU 20QFN

Analog Devices Inc.

4,576 6.65
LTC3109IUF#TRPBF

数据手册

- 20-WFQFN Exposed Pad Tape & Reel (TR) Active Energy Harvesting 6mA 30mV ~ 500mV -40°C ~ 125°C - - Surface Mount 20-QFN (4x4)
LTC3589EUJ#TRPBF

LTC3589EUJ#TRPBF

IC DC/DC CONV 8-OUTPUT 40QFN

Analog Devices Inc.

2,536 6.65
LTC3589EUJ#TRPBF

数据手册

- 40-WFQFN Exposed Pad Tape & Reel (TR) Active Handheld/Mobile Devices, OMAP™ 8µA 2.7V ~ 5.5V -40°C ~ 125°C - - Surface Mount 40-QFN (6x6)
LTC3589EUJ-1#TRPBF

LTC3589EUJ-1#TRPBF

IC CONV DC/DC 8-OUTPUT 40QFN

Analog Devices Inc.

1,949 6.65
LTC3589EUJ-1#TRPBF

数据手册

- 40-WFQFN Exposed Pad Tape & Reel (TR) Active Handheld/Mobile Devices, OMAP™ 8µA 2.7V ~ 5.5V -40°C ~ 125°C - - Surface Mount 40-QFN (6x6)
TWL6032A1B0YFFR

TWL6032A1B0YFFR

IC POWER/BATT MGMT 155DSBGA

Texas Instruments

1,138 -
TWL6032A1B0YFFR

数据手册

- 155-UFBGA, DSBGA Tape & Reel (TR) Obsolete Handheld/Mobile Devices, OMAP™ 20µA 2.5V ~ 4.8V -40°C ~ 85°C - - Surface Mount 155-DSBGA (5.21x5.36)
MC35FS4503CAER2

MC35FS4503CAER2

SYSTEM BASIS CHIP, LINEAR 0.5A V

NXP USA Inc.

2,844 6.30
MC35FS4503CAER2

数据手册

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MWCT2013AVLH

MWCT2013AVLH

NEVIS3A_WCT,64LQFP

NXP USA Inc.

3,070 -
MWCT2013AVLH

数据手册

- 64-LQFP Tray Active Wireless Power Transmitter - - - - - Surface Mount 64-LQFP (10x10)
MC35FS6503CAER2

MC35FS6503CAER2

FS6500

NXP USA Inc.

3,857 6.33
MC35FS6503CAER2

数据手册

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC33FS6600M0ESR2

MC33FS6600M0ESR2

SAFETY SBC FOR S32S2 MCU

NXP USA Inc.

3,857 6.10

-

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active Safety - 2.7V ~ 60V -40°C ~ 125°C (TA) Automotive - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33FS6600M1ESR2

MC33FS6600M1ESR2

SAFETY SBC FOR S32S2 MCU

NXP USA Inc.

3,830 6.10

-

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active Safety - 2.7V ~ 60V -40°C ~ 125°C (TA) Automotive - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33FS6600M2ESR2

MC33FS6600M2ESR2

SAFETY SBC FOR S32S2 MCU

NXP USA Inc.

2,583 6.10

-

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active Safety - 2.7V ~ 60V -40°C ~ 125°C (TA) Automotive - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200CXES

MC33PF8200CXES

IC POWER MANAGEMENT LS1043A

NXP USA Inc.

4,422 6.66
MC33PF8200CXES

数据手册

- 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200D2ES

MC33PF8200D2ES

IC POWER MANAGEMENT

NXP USA Inc.

1,363 6.66
MC33PF8200D2ES

数据手册

- 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200DBES

MC33PF8200DBES

IC POWER MANAGEMENT I.MX8QM

NXP USA Inc.

4,551 7.52
MC33PF8200DBES

数据手册

- 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200DFES

MC33PF8200DFES

I.MX8QXP WITH DDR3L

NXP USA Inc.

1,666 6.66
MC33PF8200DFES

数据手册

- 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200DHES

MC33PF8200DHES

IC POWER MANAGEMENT I.MX8QM

NXP USA Inc.

1,678 6.66
MC33PF8200DHES

数据手册

- 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200ESES

MC33PF8200ESES

IC POWER MANAGEMENT I.MX8QM

NXP USA Inc.

2,394 7.66
MC33PF8200ESES

数据手册

- 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - 2.7V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200ETES

MC33PF8200ETES

IC POWER MANAGEMENT I.MX8QM

NXP USA Inc.

1,934 6.66
MC33PF8200ETES

数据手册

- 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - 2.7V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)