| 图片 | 制造商型号 | 库存情况 | 价格 | 库存 | 数据手册 | 系列 | 封装/外壳 | 包装 | 产品状态 | 电容 | 容差 | 电压 - 击穿 | ESR（等效串联电阻） | 等效串联电感 (ESL) | 应用 | 特性 | 工作温度 | 高度 | 尺寸 / 尺寸 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
935174732547-T3ACAP SILICON 0.047UF 15% 30V 0505 |
7,750 | 3.74 |
|
数据手册 |
ATSC | 0505 (1313 Metric) | Tape & Reel (TR) | Active | 0.047 µF | ±15% | 30 V | - | - | High Stability, High Temperature, Wirebond and Embedded | - | -55°C ~ 200°C | 0.012" (0.30mm) | 0.052" L x 0.052" W (1.32mm x 1.32mm) |
|
|
935154831510-T3TC-NEW |
2,824 | - |
|
数据手册 |
UWSC | 0202 (0505 Metric) | Tape & Reel (TR) | Active | 10000 pF | - | 30 V | - | - | High Stability, Vertical Silicon Cap, Wirebond | High Reliability | -55°C ~ 150°C | 0.005" (0.12mm) | 0.020" L x 0.020" W (0.50mm x 0.50mm) |
|
|
935154632410-W0TCAP SILICON 1000PF 15% 50V SMD |
4,805 | 3.69 |
|
- |
UWSC | Nonstandard Chip | Tray | Active | 1000 pF | ±15% | 50 V | 14 mOhms | 6pH | High Stability, Vertical Silicon Cap, Wirebond | High Reliability, Low Profile | -55°C ~ 150°C | 0.005" (0.12mm) | 0.012" L x 0.012" W (0.29mm x 0.29mm) |
|
|
935154832410-W0TCAP SILICON 1000PF 15% 30V SMD |
4,374 | 3.69 |
|
数据手册 |
UWSC | Nonstandard Chip | Tray | Active | 1000 pF | ±15% | 30 V | 14 mOhms | 6pH | High Stability, Vertical Silicon Cap, Wirebond | High Reliability, Low Profile | -55°C ~ 150°C | 0.005" (0.12mm) | 0.010" L x 0.010" W (0.25mm x 0.25mm) |
|
|
935146837522-T3TC-NEW |
4,161 | - |
|
数据手册 |
WLSC | 0402 (1005 Metric) | Tape & Reel (TR) | Active | 0.022 µF | - | 30 V | - | - | High Stability, Vertical Silicon Cap, Wirebond | Low Profile | -55°C ~ 150°C | 0.005" (0.12mm) | 0.039" L x 0.020" W (1.00mm x 0.50mm) |
|
|
935152722456-T3SCAP SILICON 5600PF 15% 30V 0201 |
2,437 | 3.94 |
|
数据手册 |
UBSC | 0201 (0603 Metric) | Tape & Reel (TR) | Active | 5600 pF | ±15% | 30 V | 300 mOhms | 100pH | High Stability | High Reliability, Low Profile | -55°C ~ 150°C | 0.006" (0.14mm) | 0.024" L x 0.012" W (0.60mm x 0.30mm) |
|
|
935248520427-T3TC-NEW |
5,703 | - |
|
数据手册 |
WASC | Nonstandard Chip | Tape & Reel (TR) | Active | 2700 pF | - | 150 V | - | - | High Stability, Vertical Silicon Cap, Wirebond | - | -55°C ~ 150°C | 0.004" (0.10mm) | 0.020" L x 0.079" W (0.50mm x 2.00mm) |
|
|
935246520427-T3TC-NEW |
3,205 | - |
|
数据手册 |
WLSC | Nonstandard Chip | Tape & Reel (TR) | Active | 2700 pF | - | 150 V | - | - | High Stability, Vertical Silicon Cap, Wirebond | Low Profile | -55°C ~ 150°C | 0.004" (0.10mm) | 0.020" L x 0.079" W (0.50mm x 2.00mm) |
|
|
935152723510-T3NCAP SILICON 10000PF 15% 30V 0201 |
3,382 | 4.20 |
|
数据手册 |
UBSC | 0201 (0603 Metric) | Tape & Reel (TR) | Active | 10000 pF | ±15% | 30 V | 300 mOhms | 100pH | High Stability | High Reliability, Low Profile | -55°C ~ 150°C | 0.006" (0.14mm) | 0.031" L x 0.024" W (0.80mm x 0.60mm) |
|
|
935152722510-T3SC-NEW |
8,326 | - |
|
数据手册 |
UBSC | 0201 (0603 Metric) | Tape & Reel (TR) | Active | 10000 pF | - | 30 V | - | - | High Stability | High Reliability | -55°C ~ 150°C | 0.004" (0.10mm) | 0.024" L x 0.012" W (0.60mm x 0.30mm) |
|
|
935152493547-T3NC-NEW |
5,484 | - |
|
数据手册 |
UBSC | 0201 (0603 Metric) | Tape & Reel (TR) | Active | 0.047 µF | - | 11 V | - | - | High Stability, Wirebond and Embedded | High Reliability | -55°C ~ 150°C | 0.004" (0.10mm) | 0.031" L x 0.024" W (0.80mm x 0.60mm) |
|
|
935152422522-T3SC-NEW |
8,444 | - |
|
数据手册 |
UBSC | 0201 (0603 Metric) | Tape & Reel (TR) | Active | 0.022 µF | - | 11 V | - | - | High Stability | High Reliability | -55°C ~ 150°C | 0.004" (0.10mm) | 0.024" L x 0.012" W (0.60mm x 0.30mm) |
|
|
935157725456-W0ACAP SILICON 5600PF 15% 30V 0201 |
8,030 | 4.41 |
|
数据手册 |
UBEC | 0201 (0603 Metric) | Tray | Active | 5600 pF | ±15% | 30 V | 30 mOhms | 100pH | High Stability, Wirebond and Embedded | High Reliability | -55°C ~ 150°C | 0.005" (0.12mm) | 0.024" L x 0.012" W (0.60mm x 0.30mm) |
|
|
935157425510-W0ACAP SILICON 10000PF 15% 11V 0201 |
5,801 | 4.41 |
|
数据手册 |
UBEC | 0201 (0603 Metric) | Tray | Active | 10000 pF | ±15% | 11 V | 30 mOhms | 100pH | High Stability, Wirebond and Embedded | High Reliability | -55°C ~ 150°C | 0.005" (0.12mm) | 0.024" L x 0.012" W (0.60mm x 0.30mm) |
|
|
935156424610-T3NCAP SILICON 0.1UF 15% 11V 0402 |
4,072 | 3.26 |
|
数据手册 |
ULSC | 0402 (1005 Metric) | Tape & Reel (TR) | Active | 0.1 µF | ±15% | 11 V | 500 mOhms | 100pH | High Stability | High Reliability, Low Profile | -55°C ~ 150°C | 0.006" (0.14mm) | 0.047" L x 0.028" W (1.20mm x 0.70mm) |
|
|
935242521437-T3TC-NEW |
8,408 | - |
|
数据手册 |
WBSC | Nonstandard Chip | Tape & Reel (TR) | Active | 3700 pF | - | 150 V | - | - | High Stability, Vertical Silicon Cap, Wirebond | Low Profile | -55°C ~ 150°C | 0.004" (0.10mm) | 0.020" L x 0.049" W (0.50mm x 1.25mm) |
|
|
935247521437-T3TC-NEW |
6,764 | - |
|
数据手册 |
WASC | Nonstandard Chip | Tape & Reel (TR) | Active | 3700 pF | - | 150 V | - | - | High Stability, Vertical Silicon Cap, Wirebond | - | -55°C ~ 150°C | 0.004" (0.10mm) | 0.020" L x 0.064" W (0.50mm x 1.63mm) |
|
|
935157725410-W0ACAP SILICON 1000PF 15% 30V 0201 |
2,706 | 4.41 |
|
数据手册 |
UBEC | 0201 (0603 Metric) | Tray | Active | 1000 pF | ±15% | 30 V | 30 mOhms | 100pH | High Stability, Wirebond and Embedded | High Reliability | -55°C ~ 150°C | 0.005" (0.12mm) | 0.024" L x 0.012" W (0.60mm x 0.30mm) |
|
|
939113724547-T3NC-NEW |
4,542 | - |
|
数据手册 |
BBSC | 0201 (0603 Metric) | Tape & Reel (TR) | Active | 0.047 µF | - | 30 V | - | - | High Stability | High Reliability | -55°C ~ 150°C | 0.016" (0.41mm) | 0.031" L x 0.024" W (0.80mm x 0.60mm) |
|
|
935248521437-T3TC-NEW |
9,228 | - |
|
数据手册 |
WASC | 0402 (1005 Metric) | Tape & Reel (TR) | Active | 3700 pF | - | 150 V | - | - | High Stability, Vertical Silicon Cap, Wirebond | - | -55°C ~ 150°C | 0.016" (0.41mm) | 0.047" L x 0.028" W (1.20mm x 0.70mm) |
