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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
A3PN010-1QNG48I

A3PN010-1QNG48I

IC FPGA 34 I/O 48QFN

Microchip Technology

1,403 6.18
A3PN010-1QNG48I

数据手册

ProASIC3 nano 48-VFQFN Exposed Pad Tray Active Not Verified - - - 34 10000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 48-QFN (6x6)
AGLN010V5-UCG36

AGLN010V5-UCG36

IC FPGA 23 I/O 36UCSP

Microchip Technology

351 6.90
AGLN010V5-UCG36

数据手册

IGLOO nano 36-WFBGA, CSPBGA Tray Active Not Verified - 260 - 23 10000 1.425V ~ 1.575V Surface Mount -20°C ~ 85°C (TJ) - - 36-UCSP (3x3)
A3PN060-VQG100I

A3PN060-VQG100I

IC FPGA 71 I/O 100VQFP

Microchip Technology

567 11.75
A3PN060-VQG100I

数据手册

ProASIC3 nano 100-TQFP Tray Active Not Verified - - 18432 71 60000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 100-VQFP (14x14)
A3P125-FGG144

A3P125-FGG144

IC FPGA 97 I/O 144FBGA

Microchip Technology

612 12.43
A3P125-FGG144

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 36864 97 125000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 144-FPBGA (13x13)
A3P125-FG144I

A3P125-FG144I

IC FPGA 97 I/O 144FBGA

Microchip Technology

160 14.30
A3P125-FG144I

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 36864 97 125000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 144-FPBGA (13x13)
AGL125V5-CSG196I

AGL125V5-CSG196I

IC FPGA 133 I/O 196CSP

Microchip Technology

236 14.44
AGL125V5-CSG196I

数据手册

IGLOO 196-TFBGA, CSBGA Tray Active Not Verified - 3072 36864 133 125000 1.425V ~ 1.575V Surface Mount -40°C ~ 85°C (TA) - - 196-CSP (8x8)
A3PN125-VQG100I

A3PN125-VQG100I

IC FPGA 71 I/O 100VQFP

Microchip Technology

176 16.17
A3PN125-VQG100I

数据手册

ProASIC3 nano 100-TQFP Tray Active Not Verified - - 36864 71 125000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 100-VQFP (14x14)
A3PN250-VQ100

A3PN250-VQ100

IC FPGA 68 I/O 100VQFP

Microchip Technology

255 17.37
A3PN250-VQ100

数据手册

ProASIC3 nano 100-TQFP Tray Active Not Verified - - 36864 68 250000 1.425V ~ 1.575V Surface Mount -20°C ~ 85°C (TJ) - - 100-VQFP (14x14)
AGL250V5-FGG144

AGL250V5-FGG144

IC FPGA 97 I/O 144FBGA

Microchip Technology

160 22.13
AGL250V5-FGG144

数据手册

IGLOO 144-LBGA Tray Active Not Verified - 6144 36864 97 250000 1.425V ~ 1.575V Surface Mount 0°C ~ 70°C (TA) - - 144-FPBGA (13x13)
AGL250V5-FG144I

AGL250V5-FG144I

IC FPGA 97 I/O 144FBGA

Microchip Technology

160 25.46
AGL250V5-FG144I

数据手册

IGLOO 144-LBGA Tray Active Not Verified - 6144 36864 97 250000 1.425V ~ 1.575V Surface Mount -40°C ~ 85°C (TA) - - 144-FPBGA (13x13)