产品中心

制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
EX64-TQ64A

EX64-TQ64A

IC FPGA 41 I/O 64TQFP

Microchip Technology

3,173 -
EX64-TQ64A

数据手册

EX 64-LQFP Tray Obsolete Verified - 128 - 41 3000 2.3V ~ 2.7V Surface Mount -40°C ~ 125°C (TA) - - 64-TQFP (10x10)
A3P060-FG144T

A3P060-FG144T

IC FPGA 96 I/O 144FBGA

Microchip Technology

2,265 -
A3P060-FG144T

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 18432 96 60000 1.425V ~ 1.575V Surface Mount -40°C ~ 125°C (TA) Automotive AEC-Q100 144-FPBGA (13x13)
A3P1000-1FGG144T

A3P1000-1FGG144T

IC FPGA 97 I/O 144FBGA

Microchip Technology

4,808 -
A3P1000-1FGG144T

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 147456 97 1000000 1.425V ~ 1.575V Surface Mount -40°C ~ 125°C (TA) Automotive AEC-Q100 144-FPBGA (13x13)
A3P060-FGG144T

A3P060-FGG144T

IC FPGA 96 I/O 144FBGA

Microchip Technology

4,244 -
A3P060-FGG144T

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 18432 96 60000 1.425V ~ 1.575V Surface Mount -40°C ~ 125°C (TA) Automotive AEC-Q100 144-FPBGA (13x13)
A40MX02-VQ80A

A40MX02-VQ80A

IC FPGA 57 I/O 80VQFP

Microchip Technology

1,798 -
A40MX02-VQ80A

数据手册

MX 80-TQFP Tray Obsolete Not Verified - - - 57 3000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 125°C (TA) - - 80-VQFP (14x14)
EX128-TQG64A

EX128-TQG64A

IC FPGA 46 I/O 64TQFP

Microchip Technology

3,259 -
EX128-TQG64A

数据手册

EX 64-LQFP Tray Active Not Verified - 256 - 46 6000 2.3V ~ 2.7V Surface Mount -40°C ~ 125°C (TA) - - 64-TQFP (10x10)
EX128-TQ64A

EX128-TQ64A

IC FPGA 46 I/O 64TQFP

Microchip Technology

1,902 -
EX128-TQ64A

数据手册

EX 64-LQFP Tray Obsolete Verified - 256 - 46 6000 2.3V ~ 2.7V Surface Mount -40°C ~ 125°C (TA) - - 64-TQFP (10x10)
EX256-TQ100A

EX256-TQ100A

IC FPGA 81 I/O 100TQFP

Microchip Technology

2,733 -
EX256-TQ100A

数据手册

EX 100-LQFP Tray Obsolete Not Verified - 512 - 81 12000 2.3V ~ 2.7V Surface Mount -40°C ~ 125°C (TA) - - 100-TQFP (14x14)
A3P1000-1FG144T

A3P1000-1FG144T

IC FPGA 97 I/O 144FBGA

Microchip Technology

2,960 -
A3P1000-1FG144T

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 147456 97 1000000 1.425V ~ 1.575V Surface Mount -40°C ~ 125°C (TA) Automotive AEC-Q100 144-FPBGA (13x13)
A3P1000-1FG256T

A3P1000-1FG256T

IC FPGA 177 I/O 256FBGA

Microchip Technology

1,603 -
A3P1000-1FG256T

数据手册

ProASIC3 256-LBGA Tray Active Not Verified - - 147456 177 1000000 1.425V ~ 1.575V Surface Mount -40°C ~ 125°C (TA) Automotive AEC-Q100 256-FPBGA (17x17)