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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
AX1000-1CQ352M

AX1000-1CQ352M

IC FPGA 198 I/O 352CQFP

Microchip Technology

2,792 -
AX1000-1CQ352M

数据手册

Axcelerator 352-BFCQFP with Tie Bar Tray Active Not Verified 18144 - 165888 198 1000000 1.425V ~ 1.575V Surface Mount -55°C ~ 125°C (TA) - - 352-CQFP (75x75)
AX1000-CQ352M

AX1000-CQ352M

IC FPGA 198 I/O 352CQFP

Microchip Technology

4,094 -
AX1000-CQ352M

数据手册

Axcelerator 352-BFCQFP with Tie Bar Tray Active Not Verified 18144 - 165888 198 1000000 1.425V ~ 1.575V Surface Mount -55°C ~ 125°C (TA) - - 352-CQFP (75x75)
AX2000-1CQ256M

AX2000-1CQ256M

IC FPGA 136 I/O 256CQFP

Microchip Technology

3,097 -
AX2000-1CQ256M

数据手册

Axcelerator 256-BFCQFP with Tie Bar Tray Active Not Verified 32256 - 294912 136 2000000 1.425V ~ 1.575V Surface Mount -55°C ~ 125°C (TA) - - 256-CQFP (75x75)
AX2000-1FGG1152M

AX2000-1FGG1152M

IC FPGA 684 I/O 1152FBGA

Microchip Technology

2,201 -
AX2000-1FGG1152M

数据手册

Axcelerator 1152-BGA Tray Active Not Verified 32256 - 294912 684 2000000 1.425V ~ 1.575V Surface Mount -55°C ~ 125°C (TA) - - 1152-FPBGA (35x35)
AX2000-CQ256M

AX2000-CQ256M

IC FPGA 136 I/O 256CQFP

Microchip Technology

4,714 -
AX2000-CQ256M

数据手册

Axcelerator 256-BFCQFP with Tie Bar Tray Active Not Verified 32256 - 294912 136 2000000 1.425V ~ 1.575V Surface Mount -55°C ~ 125°C (TA) - - 256-CQFP (75x75)
AX250-1CQ208M

AX250-1CQ208M

IC FPGA 115 I/O 208CQFP

Microchip Technology

3,969 -
AX250-1CQ208M

数据手册

Axcelerator 208-BFCQFP with Tie Bar Tray Active Not Verified 4224 - 55296 115 250000 1.425V ~ 1.575V Surface Mount -55°C ~ 125°C (TA) - - 208-CQFP (75x75)
AX250-1FGG256M

AX250-1FGG256M

IC FPGA 138 I/O 256FBGA

Microchip Technology

4,701 -
AX250-1FGG256M

数据手册

Axcelerator 256-LBGA Tray Active Not Verified 4224 - 55296 138 250000 1.425V ~ 1.575V Surface Mount -55°C ~ 125°C (TA) - - 256-FPBGA (17x17)
AX250-1PQ208M

AX250-1PQ208M

IC FPGA 115 I/O 208QFP

Microchip Technology

2,601 -
AX250-1PQ208M

数据手册

Axcelerator 208-BFQFP Tray Obsolete Not Verified 4224 - 55296 115 250000 1.425V ~ 1.575V Surface Mount -55°C ~ 125°C (TA) - - 208-PQFP (28x28)
AX250-CQ208M

AX250-CQ208M

IC FPGA 115 I/O 208CQFP

Microchip Technology

1,903 -
AX250-CQ208M

数据手册

Axcelerator 208-BFCQFP with Tie Bar Tray Active Not Verified 4224 - 55296 115 250000 1.425V ~ 1.575V Surface Mount -55°C ~ 125°C (TA) - - 208-CQFP (75x75)
AX500-PQ208M

AX500-PQ208M

IC FPGA 115 I/O 208QFP

Microchip Technology

4,713 -
AX500-PQ208M

数据手册

Axcelerator 208-BFQFP Tray Obsolete Not Verified 8064 - 73728 115 500000 1.425V ~ 1.575V Surface Mount -55°C ~ 125°C (TA) - - 208-PQFP (28x28)