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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
A3P250-1FGG144I

A3P250-1FGG144I

IC FPGA 97 I/O 144FBGA

Microchip Technology

2,089 21.21
A3P250-1FGG144I

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 36864 97 250000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 144-FPBGA (13x13)
A3P250-1FG144I

A3P250-1FG144I

IC FPGA 97 I/O 144FBGA

Microchip Technology

4,726 21.21
A3P250-1FG144I

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 36864 97 250000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 144-FPBGA (13x13)
M1A3P250-1FG144I

M1A3P250-1FG144I

IC FPGA 97 I/O 144FBGA

Microchip Technology

4,362 21.21
M1A3P250-1FG144I

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 36864 97 250000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 144-FPBGA (13x13)
M1A3P250-1FGG144I

M1A3P250-1FGG144I

IC FPGA 97 I/O 144FBGA

Microchip Technology

2,633 21.21
M1A3P250-1FGG144I

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 36864 97 250000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 144-FPBGA (13x13)
AT40K10-2EQC

AT40K10-2EQC

IC FPGA 161 I/O 240QFP

Microchip Technology

2,494 -
AT40K10-2EQC

数据手册

AT40K/KLV 240-BFQFP Tray Obsolete Not Verified - 576 4608 161 20000 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C - - 240-PQFP (32x32)
M1A3P250-1PQG208

M1A3P250-1PQG208

IC FPGA 151 I/O 208QFP

Microchip Technology

2,235 21.28
M1A3P250-1PQG208

数据手册

ProASIC3 208-BFQFP Tray Active Not Verified - - 36864 151 250000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 208-PQFP (28x28)
A3P250-1PQG208

A3P250-1PQG208

IC FPGA 151 I/O 208QFP

Microchip Technology

2,695 21.28
A3P250-1PQG208

数据手册

ProASIC3 208-BFQFP Tray Active Not Verified - - 36864 151 250000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 208-PQFP (28x28)
AGL250V5-CSG196

AGL250V5-CSG196

IC FPGA 143 I/O 196CSP

Microchip Technology

1,223 21.71
AGL250V5-CSG196

数据手册

IGLOO 196-TFBGA, CSBGA Tray Active Not Verified - 6144 36864 143 250000 1.425V ~ 1.575V Surface Mount 0°C ~ 70°C (TA) - - 196-CSP (8x8)
AGL250V5-FG144

AGL250V5-FG144

IC FPGA 97 I/O 144FBGA

Microchip Technology

1,208 21.71
AGL250V5-FG144

数据手册

IGLOO 144-LBGA Tray Active Not Verified - 6144 36864 97 250000 1.425V ~ 1.575V Surface Mount 0°C ~ 70°C (TA) - - 144-FPBGA (13x13)
M1AGL250V5-FG144

M1AGL250V5-FG144

IC FPGA 97 I/O 144FBGA

Microchip Technology

1,373 21.71
M1AGL250V5-FG144

数据手册

IGLOO 144-LBGA Tray Active Not Verified - 6144 36864 97 250000 1.425V ~ 1.575V Surface Mount 0°C ~ 70°C (TA) - - 144-FPBGA (13x13)