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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
A40MX02-3PL68I

A40MX02-3PL68I

IC FPGA 57 I/O 68PLCC

Microchip Technology

4,087 -
A40MX02-3PL68I

数据手册

MX 68-LCC (J-Lead) Tray Obsolete Not Verified - - - 57 3000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 68-PLCC (24.23x24.23)
A40MX04-2PL68I

A40MX04-2PL68I

IC FPGA 57 I/O 68PLCC

Microchip Technology

1,227 -
A40MX04-2PL68I

数据手册

MX 68-LCC (J-Lead) Tray Obsolete Not Verified - - - 57 6000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 68-PLCC (24.23x24.23)
AX250-FG484

AX250-FG484

IC FPGA 248 I/O 484FBGA

Microchip Technology

1,916 -
AX250-FG484

数据手册

Axcelerator 484-BGA Tray Active Not Verified 4224 - 55296 248 250000 1.425V ~ 1.575V Surface Mount 0°C ~ 70°C (TA) - - 484-FPBGA (23x23)
A42MX36-BG272M

A42MX36-BG272M

IC FPGA 202 I/O 272BGA

Microchip Technology

1,747 -
A42MX36-BG272M

数据手册

MX 272-BBGA Tray Obsolete Not Verified - - 2560 202 54000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -55°C ~ 125°C (TC) - - 272-PBGA (27x27)
A3P600-2FGG484

A3P600-2FGG484

IC FPGA 235 I/O 484FBGA

Microchip Technology

1,037 -
A3P600-2FGG484

数据手册

ProASIC3 484-BGA Tray Active Not Verified - - 110592 235 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
AX500-2FGG676

AX500-2FGG676

IC FPGA 336 I/O 676FBGA

Microchip Technology

2,944 -
AX500-2FGG676

数据手册

Axcelerator 676-BGA Tray Active Not Verified 8064 - 73728 336 500000 1.425V ~ 1.575V Surface Mount 0°C ~ 70°C (TA) - - 676-FBGA (27x27)
A42MX09-1TQG176

A42MX09-1TQG176

IC FPGA 104 I/O 176TQFP

Microchip Technology

3,260 -
A42MX09-1TQG176

数据手册

MX 176-LQFP Tray Active Not Verified - - - 104 14000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 176-TQFP (24x24)
AX500-FGG484I

AX500-FGG484I

IC FPGA 317 I/O 484FBGA

Microchip Technology

1,333 -
AX500-FGG484I

数据手册

Axcelerator 484-BGA Tray Active Not Verified 8064 - 73728 317 500000 1.425V ~ 1.575V Surface Mount -40°C ~ 85°C (TA) - - 484-FPBGA (23x23)
A42MX36-1BG272

A42MX36-1BG272

IC FPGA 202 I/O 272BGA

Microchip Technology

2,623 881.23
A42MX36-1BG272

数据手册

MX 272-BBGA Tray Active Not Verified - - 2560 202 54000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 272-PBGA (27x27)
A42MX36-BG272

A42MX36-BG272

IC FPGA 202 I/O 272BGA

Microchip Technology

3,602 -
A42MX36-BG272

数据手册

MX 272-BBGA Tray Obsolete Not Verified - - 2560 202 54000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 272-PBGA (27x27)
A3P600L-FGG484I

A3P600L-FGG484I

IC FPGA 235 I/O 484FBGA

Microchip Technology

1,085 -
A3P600L-FGG484I

数据手册

ProASIC3L 484-BGA Tray Active Not Verified - - 110592 235 600000 1.14V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
A54SX72A-2FG484I

A54SX72A-2FG484I

IC FPGA 360 I/O 484FBGA

Microchip Technology

3,359 -
A54SX72A-2FG484I

数据手册

SX-A 484-BGA Tray Active Not Verified 6036 - - 360 108000 2.25V ~ 5.25V Surface Mount -40°C ~ 85°C (TA) - - 484-FPBGA (27X27)
A42MX36-BGG272I

A42MX36-BGG272I

IC FPGA 202 I/O 272BGA

Microchip Technology

2,085 -
A42MX36-BGG272I

数据手册

MX 272-BBGA Tray Obsolete Not Verified - - 2560 202 54000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 272-PBGA (27x27)
A3P600-FG484

A3P600-FG484

IC FPGA 235 I/O 484FBGA

Microchip Technology

4,730 -
A3P600-FG484

数据手册

ProASIC3 484-BGA Tray Active Not Verified - - 110592 235 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
A42MX36-2BG272

A42MX36-2BG272

IC FPGA 202 I/O 272BGA

Microchip Technology

2,291 -
A42MX36-2BG272

数据手册

MX 272-BBGA Tray Obsolete Not Verified - - 2560 202 54000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 272-PBGA (27x27)
A3P600L-FG484I

A3P600L-FG484I

IC FPGA 235 I/O 484FBGA

Microchip Technology

2,569 -
A3P600L-FG484I

数据手册

ProASIC3L 484-BGA Tray Active Not Verified - - 110592 235 600000 1.14V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
APA450-FGG484I

APA450-FGG484I

IC FPGA 344 I/O 484FBGA

Microchip Technology

4,868 -
APA450-FGG484I

数据手册

ProASICPLUS 484-BGA Tray Active Not Verified - - 110592 344 450000 2.3V ~ 2.7V Surface Mount -40°C ~ 85°C (TA) - - 484-FPBGA (23x23)
AX500-FG484

AX500-FG484

IC FPGA 317 I/O 484FBGA

Microchip Technology

2,735 -
AX500-FG484

数据手册

Axcelerator 484-BGA Tray Active Not Verified 8064 - 73728 317 500000 1.425V ~ 1.575V Surface Mount 0°C ~ 70°C (TA) - - 484-FPBGA (23x23)
APA450-FG484I

APA450-FG484I

IC FPGA 344 I/O 484FBGA

Microchip Technology

2,601 -
APA450-FG484I

数据手册

ProASICPLUS 484-BGA Tray Active Not Verified - - 110592 344 450000 2.3V ~ 2.7V Surface Mount -40°C ~ 85°C (TA) - - 484-FPBGA (23x23)
AX1000-2FG676I

AX1000-2FG676I

IC FPGA 418 I/O 676FBGA

Microchip Technology

2,725 -
AX1000-2FG676I

数据手册

Axcelerator 676-BGA Tray Active Not Verified 18144 - 165888 418 1000000 1.425V ~ 1.575V Surface Mount -40°C ~ 85°C (TA) - - 676-FBGA (27x27)