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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
A3P600-1FGG484I

A3P600-1FGG484I

IC FPGA 235 I/O 484FBGA

Microchip Technology

4,368 -
A3P600-1FGG484I

数据手册

ProASIC3 484-BGA Tray Active Not Verified - - 110592 235 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
A54SX32A-FG484

A54SX32A-FG484

IC FPGA 249 I/O 484FBGA

Microchip Technology

3,491 -
A54SX32A-FG484

数据手册

SX-A 484-BGA Tray Active Not Verified 2880 - - 249 48000 2.25V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 484-FPBGA (27X27)
A3P600L-1FGG484I

A3P600L-1FGG484I

IC FPGA 235 I/O 484FBGA

Microchip Technology

1,287 -
A3P600L-1FGG484I

数据手册

ProASIC3L 484-BGA Tray Active Not Verified - - 110592 235 600000 1.14V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
A3P600-FGG484I

A3P600-FGG484I

IC FPGA 235 I/O 484FBGA

Microchip Technology

4,033 -
A3P600-FGG484I

数据手册

ProASIC3 484-BGA Tray Active Not Verified - - 110592 235 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
A54SX72A-FG484

A54SX72A-FG484

IC FPGA 360 I/O 484FBGA

Microchip Technology

1,028 -
A54SX72A-FG484

数据手册

SX-A 484-BGA Tray Active Not Verified 6036 - - 360 108000 2.25V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 484-FPBGA (27X27)
AX500-FGG676

AX500-FGG676

IC FPGA 336 I/O 676FBGA

Microchip Technology

4,041 -
AX500-FGG676

数据手册

Axcelerator 676-BGA Tray Active Not Verified 8064 - 73728 336 500000 1.425V ~ 1.575V Surface Mount 0°C ~ 70°C (TA) - - 676-FBGA (27x27)
A54SX72A-FGG484

A54SX72A-FGG484

IC FPGA 360 I/O 484FBGA

Microchip Technology

4,123 -
A54SX72A-FGG484

数据手册

SX-A 484-BGA Tray Active Not Verified 6036 - - 360 108000 2.25V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 484-FPBGA (27X27)
A3P600-FG484I

A3P600-FG484I

IC FPGA 235 I/O 484FBGA

Microchip Technology

4,092 -
A3P600-FG484I

数据手册

ProASIC3 484-BGA Tray Active Not Verified - - 110592 235 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
AX500-FG676I

AX500-FG676I

IC FPGA 336 I/O 676FBGA

Microchip Technology

2,257 -
AX500-FG676I

数据手册

Axcelerator 676-BGA Tray Active Not Verified 8064 - 73728 336 500000 1.425V ~ 1.575V Surface Mount -40°C ~ 85°C (TA) - - 676-FBGA (27x27)
A42MX36-1BG272M

A42MX36-1BG272M

IC FPGA 202 I/O 272BGA

Microchip Technology

1,031 3327.42
A42MX36-1BG272M

数据手册

MX 272-BBGA Tray Active Not Verified - - 2560 202 54000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -55°C ~ 125°C (TC) - - 272-PBGA (27x27)
A42MX36-2BG272I

A42MX36-2BG272I

IC FPGA 202 I/O 272BGA

Microchip Technology

3,696 -
A42MX36-2BG272I

数据手册

MX 272-BBGA Tray Obsolete Not Verified - - 2560 202 54000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 272-PBGA (27x27)
A54SX16A-PQ208

A54SX16A-PQ208

IC FPGA 175 I/O 208QFP

Microchip Technology

3,018 -
A54SX16A-PQ208

数据手册

SX-A 208-BFQFP Tray Obsolete Not Verified 1452 - - 175 24000 2.25V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 208-PQFP (28x28)
APA150-PQ208

APA150-PQ208

IC FPGA 158 I/O 208QFP

Microchip Technology

3,895 -
APA150-PQ208

数据手册

ProASICPLUS 208-BFQFP Tray Obsolete Not Verified - - 36864 158 150000 2.3V ~ 2.7V Surface Mount 0°C ~ 70°C (TA) - - 208-PQFP (28x28)
A3P400-PQ208

A3P400-PQ208

IC FPGA 151 I/O 208QFP

Microchip Technology

1,425 -
A3P400-PQ208

数据手册

ProASIC3 208-BFQFP Tray Obsolete Not Verified - - 55296 151 400000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 208-PQFP (28x28)
A40MX04-PL84I

A40MX04-PL84I

IC FPGA 69 I/O 84PLCC

Microchip Technology

2,437 -
A40MX04-PL84I

数据手册

MX 84-LCC (J-Lead) Tray Obsolete Not Verified - - - 69 6000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 84-PLCC (29.31x29.31)
M1A3P400-PQ208

M1A3P400-PQ208

IC FPGA 151 I/O 208QFP

Microchip Technology

2,912 -

-

ProASIC3 208-BFQFP Tray Obsolete Not Verified - - 55296 151 400000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 208-PQFP (28x28)
A54SX16A-PQG208I

A54SX16A-PQG208I

IC FPGA 175 I/O 208QFP

Microchip Technology

2,250 -
A54SX16A-PQG208I

数据手册

SX-A 208-BFQFP Tray Active Not Verified 1452 - - 175 24000 2.25V ~ 5.25V Surface Mount -40°C ~ 85°C (TA) - - 208-PQFP (28x28)
A54SX16A-1PQ208

A54SX16A-1PQ208

IC FPGA 175 I/O 208QFP

Microchip Technology

1,516 -
A54SX16A-1PQ208

数据手册

SX-A 208-BFQFP Tray Obsolete Not Verified 1452 - - 175 24000 2.25V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 208-PQFP (28x28)
M1A3P400-PQ208I

M1A3P400-PQ208I

IC FPGA 151 I/O 208QFP

Microchip Technology

3,830 -

-

ProASIC3 208-BFQFP Tray Obsolete Not Verified - - 55296 151 400000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 208-PQFP (28x28)
A3P400-1PQ208I

A3P400-1PQ208I

IC FPGA 151 I/O 208QFP

Microchip Technology

1,603 -
A3P400-1PQ208I

数据手册

ProASIC3 208-BFQFP Tray Obsolete Not Verified - - 55296 151 400000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 208-PQFP (28x28)