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图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 架构 核心处理器 闪存大小 RAM 大小 外设 连接性 速度 主要属性 工作温度 等级 认证 供应商设备封装
M2S090-1FGG676I

M2S090-1FGG676I

IC SOC CORTEX-M3 166MHZ 676FBGA

Microchip Technology

2,805 261.49
M2S090-1FGG676I

数据手册

SmartFusion®2 676-BGA Tray Active MCU, FPGA ARM® Cortex®-M3 512KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 90K Logic Modules -40°C ~ 100°C (TJ) - - 676-FBGA (27x27)
M2S150-FCV484

M2S150-FCV484

IC SOC CORTEX-M3 166MHZ 484FBGA

Microchip Technology

1,062 270.13
M2S150-FCV484

数据手册

SmartFusion®2 484-BFBGA Tray Active MCU, FPGA ARM® Cortex®-M3 512KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 150K Logic Modules 0°C ~ 85°C (TJ) - - 484-FBGA (19x19)
M2S150-FCVG484

M2S150-FCVG484

IC SOC CORTEX-M3 166MHZ 484FBGA

Microchip Technology

3,180 270.13
M2S150-FCVG484

数据手册

SmartFusion®2 484-BFBGA Tray Active MCU, FPGA ARM® Cortex®-M3 512KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 150K Logic Modules 0°C ~ 85°C (TJ) - - 484-FBGA (19x19)
M2S090T-1FGG676I

M2S090T-1FGG676I

IC SOC CORTEX-M3 166MHZ 676FBGA

Microchip Technology

2,976 280.18
M2S090T-1FGG676I

数据手册

SmartFusion®2 676-BGA Tray Active MCU, FPGA ARM® Cortex®-M3 512KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 90K Logic Modules -40°C ~ 100°C (TJ) - - 676-FBGA (27x27)
M2S090T-1FG676I

M2S090T-1FG676I

IC SOC CORTEX-M3 166MHZ 676FBGA

Microchip Technology

1,837 280.18
M2S090T-1FG676I

数据手册

SmartFusion®2 676-BGA Tray Active MCU, FPGA ARM® Cortex®-M3 512KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 90K Logic Modules -40°C ~ 100°C (TJ) - - 676-FBGA (27x27)
M2S090TS-1FG676

M2S090TS-1FG676

IC SOC CORTEX-M3 166MHZ 676FBGA

Microchip Technology

3,260 280.18
M2S090TS-1FG676

数据手册

SmartFusion®2 676-BGA Tray Active MCU, FPGA ARM® Cortex®-M3 512KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 90K Logic Modules 0°C ~ 85°C (TJ) - - 676-FBGA (27x27)
M2S090TS-1FGG676

M2S090TS-1FGG676

IC SOC CORTEX-M3 166MHZ 676FBGA

Microchip Technology

1,788 280.18
M2S090TS-1FGG676

数据手册

SmartFusion®2 676-BGA Tray Active MCU, FPGA ARM® Cortex®-M3 512KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 90K Logic Modules 0°C ~ 85°C (TJ) - - 676-FBGA (27x27)
M2S090TS-FG676I

M2S090TS-FG676I

IC SOC CORTEX-M3 166MHZ 676FBGA

Microchip Technology

2,162 280.18
M2S090TS-FG676I

数据手册

SmartFusion®2 676-BGA Tray Active MCU, FPGA ARM® Cortex®-M3 512KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 90K Logic Modules -40°C ~ 100°C (TJ) - - 676-FBGA (27x27)
M2S090TS-FGG676I

M2S090TS-FGG676I

IC SOC CORTEX-M3 166MHZ 676FBGA

Microchip Technology

4,444 280.18
M2S090TS-FGG676I

数据手册

SmartFusion®2 676-BGA Tray Active MCU, FPGA ARM® Cortex®-M3 512KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 90K Logic Modules -40°C ~ 100°C (TJ) - - 676-FBGA (27x27)
M2S050T-1FG484M

M2S050T-1FG484M

IC SOC CORTEX-M3 166MHZ 484FBGA

Microchip Technology

3,443 285.81
M2S050T-1FG484M

数据手册

SmartFusion®2 484-BGA Tray Active MCU, FPGA ARM® Cortex®-M3 256KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 50K Logic Modules -55°C ~ 125°C (TJ) - - 484-FPBGA (23x23)