图片 | 制造商型号 | 库存情况 | 价格 | 库存 | 数据手册 | 系列 | 封装/外壳 | 包装 | 产品状态 | 架构 | 核心处理器 | 闪存大小 | RAM 大小 | 外设 | 连接性 | 速度 | 主要属性 | 工作温度 | 等级 | 认证 | 供应商设备封装 |
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M2S090-1FGG676IIC SOC CORTEX-M3 166MHZ 676FBGA Microchip Technology |
2,805 | 261.49 |
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![]() 数据手册 |
SmartFusion®2 | 676-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 90K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 676-FBGA (27x27) |
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M2S150-FCV484IC SOC CORTEX-M3 166MHZ 484FBGA Microchip Technology |
1,062 | 270.13 |
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![]() 数据手册 |
SmartFusion®2 | 484-BFBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 150K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 484-FBGA (19x19) |
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M2S150-FCVG484IC SOC CORTEX-M3 166MHZ 484FBGA Microchip Technology |
3,180 | 270.13 |
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![]() 数据手册 |
SmartFusion®2 | 484-BFBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 150K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 484-FBGA (19x19) |
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M2S090T-1FGG676IIC SOC CORTEX-M3 166MHZ 676FBGA Microchip Technology |
2,976 | 280.18 |
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![]() 数据手册 |
SmartFusion®2 | 676-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 90K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 676-FBGA (27x27) |
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M2S090T-1FG676IIC SOC CORTEX-M3 166MHZ 676FBGA Microchip Technology |
1,837 | 280.18 |
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![]() 数据手册 |
SmartFusion®2 | 676-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 90K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 676-FBGA (27x27) |
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M2S090TS-1FG676IC SOC CORTEX-M3 166MHZ 676FBGA Microchip Technology |
3,260 | 280.18 |
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![]() 数据手册 |
SmartFusion®2 | 676-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 90K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 676-FBGA (27x27) |
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M2S090TS-1FGG676IC SOC CORTEX-M3 166MHZ 676FBGA Microchip Technology |
1,788 | 280.18 |
|
![]() 数据手册 |
SmartFusion®2 | 676-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 90K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 676-FBGA (27x27) |
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M2S090TS-FG676IIC SOC CORTEX-M3 166MHZ 676FBGA Microchip Technology |
2,162 | 280.18 |
|
![]() 数据手册 |
SmartFusion®2 | 676-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 90K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 676-FBGA (27x27) |
|
M2S090TS-FGG676IIC SOC CORTEX-M3 166MHZ 676FBGA Microchip Technology |
4,444 | 280.18 |
|
![]() 数据手册 |
SmartFusion®2 | 676-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 90K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 676-FBGA (27x27) |
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M2S050T-1FG484MIC SOC CORTEX-M3 166MHZ 484FBGA Microchip Technology |
3,443 | 285.81 |
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![]() 数据手册 |
SmartFusion®2 | 484-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 50K Logic Modules | -55°C ~ 125°C (TJ) | - | - | 484-FPBGA (23x23) |