产品中心

制造商 系列 封装/外壳 包装 产品状态 架构 核心处理器 闪存大小 RAM 大小 外设 连接性 速度 主要属性 工作温度 等级 认证 供应商设备封装

















































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 架构 核心处理器 闪存大小 RAM 大小 外设 连接性 速度 主要属性 工作温度 等级 认证 供应商设备封装
M2S050T-1FGG484M

M2S050T-1FGG484M

IC SOC CORTEX-M3 166MHZ 484FBGA

Microchip Technology

3,159 285.81
M2S050T-1FGG484M

数据手册

SmartFusion®2 484-BGA Tray Active MCU, FPGA ARM® Cortex®-M3 256KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 50K Logic Modules -55°C ~ 125°C (TJ) - - 484-FPBGA (23x23)
M2S150-FC1152

M2S150-FC1152

IC SOC CORTEX-M3 166MHZ 1152BGA

Microchip Technology

3,105 293.29
M2S150-FC1152

数据手册

SmartFusion®2 1152-BBGA, FCBGA Tray Active MCU, FPGA ARM® Cortex®-M3 512KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 150K Logic Modules 0°C ~ 85°C (TJ) - - 1152-FCBGA (35x35)
M2S150-FCG1152

M2S150-FCG1152

IC SOC CORTEX-M3 166MHZ 1152BGA

Microchip Technology

1,360 293.29
M2S150-FCG1152

数据手册

SmartFusion®2 1152-BBGA, FCBGA Tray Active MCU, FPGA ARM® Cortex®-M3 512KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 150K Logic Modules 0°C ~ 85°C (TJ) - - 1152-FCBGA (35x35)
M2S060T-1FG484M

M2S060T-1FG484M

IC SOC CORTEX-M3 166MHZ 484FBGA

Microchip Technology

3,753 300.10
M2S060T-1FG484M

数据手册

SmartFusion®2 484-BGA Tray Active MCU, FPGA ARM® Cortex®-M3 256KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 60K Logic Modules -55°C ~ 125°C (TJ) - - 484-FPBGA (23x23)
M2S060T-1FGG484M

M2S060T-1FGG484M

IC SOC CORTEX-M3 166MHZ 484FBGA

Microchip Technology

4,831 300.10
M2S060T-1FGG484M

数据手册

SmartFusion®2 484-BGA Tray Active MCU, FPGA ARM® Cortex®-M3 256KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 60K Logic Modules -55°C ~ 125°C (TJ) - - 484-FPBGA (23x23)
M2S090TS-1FG676I

M2S090TS-1FG676I

IC SOC CORTEX-M3 166MHZ 676FBGA

Microchip Technology

2,574 308.18
M2S090TS-1FG676I

数据手册

SmartFusion®2 676-BGA Tray Active MCU, FPGA ARM® Cortex®-M3 512KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 90K Logic Modules -40°C ~ 100°C (TJ) - - 676-FBGA (27x27)
M2S090TS-1FGG676I

M2S090TS-1FGG676I

IC SOC CORTEX-M3 166MHZ 676FBGA

Microchip Technology

4,838 308.18
M2S090TS-1FGG676I

数据手册

SmartFusion®2 676-BGA Tray Active MCU, FPGA ARM® Cortex®-M3 512KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 90K Logic Modules -40°C ~ 100°C (TJ) - - 676-FBGA (27x27)
M2S150-FCS536

M2S150-FCS536

IC SOC CORTEX-M3 166MHZ 536BGA

Microchip Technology

3,470 310.66
M2S150-FCS536

数据手册

SmartFusion®2 536-LFBGA, CSPBGA Tray Active MCU, FPGA ARM® Cortex®-M3 512KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 150K Logic Modules 0°C ~ 85°C (TJ) - - 536-CSPBGA (16x16)
M2S150-FCSG536

M2S150-FCSG536

IC SOC CORTEX-M3 166MHZ 536BGA

Microchip Technology

1,835 310.66
M2S150-FCSG536

数据手册

SmartFusion®2 536-LFBGA, CSPBGA Tray Active MCU, FPGA ARM® Cortex®-M3 512KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 150K Logic Modules 0°C ~ 85°C (TJ) - - 536-CSPBGA (16x16)
M2S150T-FCV484

M2S150T-FCV484

IC SOC CORTEX-M3 166MHZ 484FBGA

Microchip Technology

1,765 311.80
M2S150T-FCV484

数据手册

SmartFusion®2 484-BFBGA Tray Active MCU, FPGA ARM® Cortex®-M3 512KB 64KB DDR, PCIe, SERDES CANbus, Ethernet, I2C, SPI, UART/USART, USB 166MHz FPGA - 150K Logic Modules 0°C ~ 85°C (TJ) - - 484-FBGA (19x19)