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图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 应用 电流 - 电源 电压 - 电源 工作温度 等级 认证 安装类型 供应商设备封装
MFS2325BMBA0EP

MFS2325BMBA0EP

MFS2325BMBA0EP

NXP USA Inc.

2,239 -
MFS2325BMBA0EP

数据手册

- 48-VFQFN Exposed Pad Bulk Active System Basis Chip - 3.3V, 5V -40°C ~ 120°C - - Surface Mount, Wettable Flank 48-HVQFN (7x7)
LTC3725EMSE#TRPBF

LTC3725EMSE#TRPBF

IC SEC SIDE CTRLR 10MSOP

Analog Devices Inc.

1,335 3.70
LTC3725EMSE#TRPBF

数据手册

- 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Exposed Pad Tape & Reel (TR) Active Secondary-Side Controller 2.1mA 7V ~ 15V 0°C ~ 85°C (TA) - - Surface Mount 10-MSOP-EP
MPF5024AMMA0ESR2

MPF5024AMMA0ESR2

POWER MANAGEMENT IC, PRE-PROG, 4

NXP USA Inc.

2,956 3.29

-

- 40-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8 Processor Based - 2.5V ~ 5.5V -40°C ~ 125°C (TA) - - Surface Mount, Wettable Flank 40-HVQFN (6x6)
MPF5024AVNA0ESR2

MPF5024AVNA0ESR2

PF5024

NXP USA Inc.

1,779 3.29

-

- 40-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8 Processor Based - 2.5V ~ 5.5V -40°C ~ 125°C (TA) - - Surface Mount, Wettable Flank 40-HVQFN (6x6)
MPF5032BMMA0ESR2

MPF5032BMMA0ESR2

PMIC 2 BUCKS 2 LDO A1 DIE

NXP USA Inc.

3,027 -
MPF5032BMMA0ESR2

数据手册

- 40-PowerVFQFN Tape & Reel (TR) Active System Basis Chip - 3.3V ~ 5.25V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 40-HVQFN (6x6)
MPF5032BMMA5ESR2

MPF5032BMMA5ESR2

PMIC 2 BUCKS 2 LDO A1 DIE

NXP USA Inc.

4,796 -
MPF5032BMMA5ESR2

数据手册

- 40-PowerVFQFN Tape & Reel (TR) Active System Basis Chip - 3.3V ~ 5.25V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 40-HVQFN (6x6)
MPF5023CVNA0ES

MPF5023CVNA0ES

POWER MANAGEMENT IC, PRE-PROG, 3

NXP USA Inc.

3,918 -
MPF5023CVNA0ES

数据手册

- 40-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based 200µA 2.5V ~ 5.5V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 40-HVQFN (6x6)
MPF5023CMMA0ES

MPF5023CMMA0ES

POWER MANAGEMENT IC, PRE-PROG, 3

NXP USA Inc.

4,216 -
MPF5023CMMA0ES

数据手册

- 40-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based 200µA 2.5V ~ 5.5V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 40-HVQFN (6x6)
O3852AQDCARQ1

O3852AQDCARQ1

AUTOMOTIVE HIGH VOLTAGE

Texas Instruments

4,327 3.66
O3852AQDCARQ1

数据手册

- 48-PowerTFSOP (0.240", 6.10mm Width) Tape & Reel (TR) Active - - 2.3V ~ 36V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount 48-HTSSOP
O3854AQDCARQ1

O3854AQDCARQ1

AUTOMOTIVE MULTI-RAIL POWER SUPP

Texas Instruments

3,987 3.66
O3854AQDCARQ1

数据手册

- 48-PowerTFSOP (0.240", 6.10mm Width) Tape & Reel (TR) Active - - 2.3V ~ 36V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount 48-HTSSOP
MC33FS6505NAER2

MC33FS6505NAER2

SYSTEM BASIS CHIP, DCDC 0.8A VCO

NXP USA Inc.

4,807 -
MC33FS6505NAER2

数据手册

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC33FS4500NAER2

MC33FS4500NAER2

SYSTEM BASIS CHIP LINEAR 0.5A V

NXP USA Inc.

4,594 3.52
MC33FS4500NAER2

数据手册

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C - - Surface Mount 48-HLQFP (7x7)
MPF5032BMBA0ESR2

MPF5032BMBA0ESR2

PMIC 2 BUCKS 2 LDO A1 DIE

NXP USA Inc.

4,080 -
MPF5032BMBA0ESR2

数据手册

- 40-PowerVFQFN Tape & Reel (TR) Active System Basis Chip - 3.3V ~ 5.25V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 40-HVQFN (6x6)
MFS8630BMBA0ESR2

MFS8630BMBA0ESR2

SAFETY SYSTEM BASIS CHIP FOR DOM

NXP USA Inc.

1,620 -
MFS8630BMBA0ESR2

数据手册

- 48-VFQFN Exposed Pad Tape & Reel (TR) Active Camera - 36V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 48-HVQFN (7x7)
MPF5023AMBA0ESR2

MPF5023AMBA0ESR2

POWER MANAGEMENT IC, PRE-PROG, 3

NXP USA Inc.

2,859 -
MPF5023AMBA0ESR2

数据手册

- 40-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based 200µA 2.5V ~ 5.5V -40°C ~ 125°C (TA) - - Surface Mount, Wettable Flank 40-HVQFN (6x6)
MPF5023CMBA0ESR2

MPF5023CMBA0ESR2

POWER MANAGEMENT IC, PRE-PROG, 3

NXP USA Inc.

4,435 -
MPF5023CMBA0ESR2

数据手册

- 40-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based 200µA 2.5V ~ 5.5V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 40-HVQFN (6x6)
MD1730-I/M2

MD1730-I/M2

IC ULTRASOUND IMAGING 36VQFN

Microchip Technology

4,599 -
MD1730-I/M2

数据手册

- 36-VFQFN Exposed Pad Tray Obsolete Ultrasound Imaging - 4.75V ~ 5.25V 0°C ~ 85°C - - Surface Mount 36-SQFN (6x6)
MFS8622BMBA0ESR2

MFS8622BMBA0ESR2

SAFETY SYSTEM BASIS CHIP FOR DOM

NXP USA Inc.

4,503 -
MFS8622BMBA0ESR2

数据手册

- 48-VFQFN Exposed Pad Tape & Reel (TR) Active Camera - 36V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 48-HVQFN (7x7)
MC33FS4505KAER2

MC33FS4505KAER2

SYSTEM BASIS CHIP, LINEAR 0.5A V

NXP USA Inc.

3,462 -
MC33FS4505KAER2

数据手册

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MFS8621BMBA0ES

MFS8621BMBA0ES

IC FS86 SYSTEM BASIS CHIP ASIL

NXP USA Inc.

2,802 3.66

-

- 48-VFQFN Exposed Pad Tray Active Camera - 4.5V ~ 36V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount 48-QFN (7x7)