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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
M1A3P1000-FG256I

M1A3P1000-FG256I

IC FPGA 177 I/O 256FBGA

Microchip Technology

2,821 81.46

-

ProASIC3 256-LBGA Tray Active Not Verified - - 147456 177 1000000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
M1A3P1000-FGG256I

M1A3P1000-FGG256I

IC FPGA 177 I/O 256FBGA

Microchip Technology

2,683 81.46

-

ProASIC3 256-LBGA Tray Active Not Verified - - 147456 177 1000000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
AGL400V5-CS196I

AGL400V5-CS196I

IC FPGA 143 I/O 196CSP

Microchip Technology

3,632 -
AGL400V5-CS196I

数据手册

IGLOO 196-TFBGA, CSBGA Tray Active Not Verified - 9216 55296 143 400000 1.425V ~ 1.575V Surface Mount -40°C ~ 85°C (TA) - - 196-CSP (8x8)
M1A3P1000-1FG144I

M1A3P1000-1FG144I

IC FPGA 97 I/O 144FBGA

Microchip Technology

4,559 82.12

-

ProASIC3 144-LBGA Tray Active Not Verified - - 147456 97 1000000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 144-FPBGA (13x13)
M1A3P1000-1FGG144I

M1A3P1000-1FGG144I

IC FPGA 97 I/O 144FBGA

Microchip Technology

1,140 82.12

-

ProASIC3 144-LBGA Tray Active Not Verified - - 147456 97 1000000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 144-FPBGA (13x13)
A3P1000-1FG144I

A3P1000-1FG144I

IC FPGA 97 I/O 144FBGA

Microchip Technology

3,025 82.12
A3P1000-1FG144I

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 147456 97 1000000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 144-FPBGA (13x13)
A3P1000-1FGG144I

A3P1000-1FGG144I

IC FPGA 97 I/O 144FBGA

Microchip Technology

2,704 82.12
A3P1000-1FGG144I

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 147456 97 1000000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 144-FPBGA (13x13)
A40MX04-1PLG68

A40MX04-1PLG68

IC FPGA 57 I/O 68PLCC

Microchip Technology

3,738 82.60
A40MX04-1PLG68

数据手册

MX 68-LCC (J-Lead) Tray Active Not Verified - - - 57 6000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 68-PLCC (24.23x24.23)
M2GL050T-VF400

M2GL050T-VF400

IC FPGA 207 I/O 400VFBGA

Microchip Technology

2,092 87.50
M2GL050T-VF400

数据手册

IGLOO2 400-LFBGA Tray Active Not Verified - 56340 1869824 207 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 400-VFBGA (17x17)
M2GL050T-VFG400

M2GL050T-VFG400

IC FPGA 207 I/O 400VFBGA

Microchip Technology

1,808 87.50
M2GL050T-VFG400

数据手册

IGLOO2 400-LFBGA Tray Active Not Verified - 56340 1869824 207 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 400-VFBGA (17x17)