产品中心

制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
M2GL060-1FCSG325I

M2GL060-1FCSG325I

IC FPGA 200 I/O 324CSBGA

Microchip Technology

2,334 87.00
M2GL060-1FCSG325I

数据手册

IGLOO2 325-TFBGA, FCBGA Tray Active Not Verified - 56520 1869824 200 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 325-FCBGA (11x11)
M1A3P1000-1PQG208

M1A3P1000-1PQG208

IC FPGA 154 I/O 208QFP

Microchip Technology

2,292 79.85

-

ProASIC3 208-BFQFP Tray Active Not Verified - - 147456 154 1000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 208-PQFP (28x28)
A3P1000-1PQG208

A3P1000-1PQG208

IC FPGA 154 I/O 208QFP

Microchip Technology

3,456 79.85
A3P1000-1PQG208

数据手册

ProASIC3 208-BFQFP Tray Active Not Verified - - 147456 154 1000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 208-PQFP (28x28)
AT6010A-2AU

AT6010A-2AU

IC FPGA 120 I/O 144LQFP

Microchip Technology

3,663 87.12
AT6010A-2AU

数据手册

AT6000(LV) 144-LQFP Tray Active Not Verified - 6400 - 120 30000 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TC) - - 144-LQFP (20x20)
EX128-PTQG100I

EX128-PTQG100I

IC FPGA 70 I/O 100TQFP

Microchip Technology

2,590 80.46
EX128-PTQG100I

数据手册

EX 100-LQFP Tray Active Not Verified - 256 - 70 6000 2.3V ~ 2.7V Surface Mount -40°C ~ 85°C (TA) - - 100-TQFP (14x14)
A3PE600-1FG484

A3PE600-1FG484

IC FPGA 270 I/O 484FBGA

Microchip Technology

2,688 80.37
A3PE600-1FG484

数据手册

ProASIC3E 484-BGA Tray Active Not Verified - - 110592 270 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
A3PE600-1FGG484

A3PE600-1FGG484

IC FPGA 270 I/O 484FBGA

Microchip Technology

1,567 80.37
A3PE600-1FGG484

数据手册

ProASIC3E 484-BGA Tray Active Not Verified - - 110592 270 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
EX256-TQG100A

EX256-TQG100A

IC FPGA 81 I/O 100TQFP

Microchip Technology

4,260 82.13
EX256-TQG100A

数据手册

EX 100-LQFP Tray Active Not Verified - 512 - 81 12000 2.3V ~ 2.7V Surface Mount -40°C ~ 125°C (TA) - - 100-TQFP (14x14)
A40MX02-2PLG44I

A40MX02-2PLG44I

IC FPGA 34 I/O 44PLCC

Microchip Technology

4,061 81.24
A40MX02-2PLG44I

数据手册

MX 44-LCC (J-Lead) Tray Active Not Verified - - - 34 3000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 44-PLCC (16.59x16.59)
A40MX04-1PLG44

A40MX04-1PLG44

IC FPGA 34 I/O 44PLCC

Microchip Technology

4,186 81.24
A40MX04-1PLG44

数据手册

MX 44-LCC (J-Lead) Tray Active Not Verified - - - 34 6000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 44-PLCC (16.59x16.59)