产品中心

制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
EX256-TQG100

EX256-TQG100

IC FPGA 81 I/O 100TQFP

Microchip Technology

2,596 57.67
EX256-TQG100

数据手册

EX 100-LQFP Tray Active Not Verified - 512 - 81 12000 2.3V ~ 2.7V Surface Mount 0°C ~ 70°C (TA) - - 100-TQFP (14x14)
M2GL025-VF400I

M2GL025-VF400I

IC FPGA 207 I/O 400VFBGA

Microchip Technology

3,255 59.09
M2GL025-VF400I

数据手册

IGLOO2 400-LFBGA Tray Active Not Verified - 27696 1130496 207 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 400-VFBGA (17x17)
A3P1000-FGG144

A3P1000-FGG144

IC FPGA 97 I/O 144FBGA

Microchip Technology

1,442 65.71
A3P1000-FGG144

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 147456 97 1000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 144-FPBGA (13x13)
A40MX02-PLG68I

A40MX02-PLG68I

IC FPGA 57 I/O 68PLCC

Microchip Technology

1,148 67.66
A40MX02-PLG68I

数据手册

MX 68-LCC (J-Lead) Tray Active Not Verified - - - 57 3000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 68-PLCC (24.23x24.23)
A54SX08A-TQG100I

A54SX08A-TQG100I

IC FPGA 81 I/O 100TQFP

Microchip Technology

105 80.13
A54SX08A-TQG100I

数据手册

SX-A 100-LQFP Tray Active Not Verified 768 - - 81 12000 2.25V ~ 5.25V Surface Mount -40°C ~ 85°C (TA) - - 100-TQFP (14x14)
AGL600V5-FG144I

AGL600V5-FG144I

IC FPGA 97 I/O 144FBGA

Microchip Technology

185 84.30
AGL600V5-FG144I

数据手册

IGLOO 144-LBGA Tray Active Not Verified - 13824 110592 97 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 85°C (TA) - - 144-FPBGA (13x13)
APA150-FGG256

APA150-FGG256

IC FPGA 186 I/O 256FBGA

Microchip Technology

3,516 95.83
APA150-FGG256

数据手册

ProASICPLUS 256-LBGA Tray Active Not Verified - - 36864 186 150000 2.3V ~ 2.7V Surface Mount 0°C ~ 70°C (TA) - - 256-FPBGA (17x17)
M2GL050-FG484I

M2GL050-FG484I

IC FPGA 267 I/O 484FBGA

Microchip Technology

1,779 95.85
M2GL050-FG484I

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 56340 1869824 267 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
M2GL060-FG484I

M2GL060-FG484I

IC FPGA 267 I/O 484FBGA

Microchip Technology

4,004 100.63
M2GL060-FG484I

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 56520 1869824 267 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
A3P1000-2FG484I

A3P1000-2FG484I

IC FPGA 300 I/O 484FBGA

Microchip Technology

4,891 110.44
A3P1000-2FG484I

数据手册

ProASIC3 484-BGA Tray Active Not Verified - - 147456 300 1000000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)