产品中心

制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
APA300-FGG256

APA300-FGG256

IC FPGA 186 I/O 256FBGA

Microchip Technology

3,203 210.86
APA300-FGG256

数据手册

ProASICPLUS 256-LBGA Tray Active Not Verified - - 73728 186 300000 2.3V ~ 2.7V Surface Mount 0°C ~ 70°C (TA) - - 256-FPBGA (17x17)
A42MX16-PQG208I

A42MX16-PQG208I

IC FPGA 140 I/O 208QFP

Microchip Technology

4,258 207.18
A42MX16-PQG208I

数据手册

MX 208-BFQFP Tray Active Not Verified - - - 140 24000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 208-PQFP (28x28)
M2GL090T-1FG676I

M2GL090T-1FG676I

IC FPGA 425 I/O 676FBGA

Microchip Technology

1,027 228.74
M2GL090T-1FG676I

数据手册

IGLOO2 676-BGA Tray Active Not Verified - 86316 2648064 425 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 676-FBGA (27x27)
M2GL090TS-1FGG484I

M2GL090TS-1FGG484I

IC FPGA 267 I/O 484FBGA

Microchip Technology

3,667 229.62
M2GL090TS-1FGG484I

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 86316 2648064 267 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
A3P1000-FG256M

A3P1000-FG256M

IC FPGA 177 I/O 256FBGA

Microchip Technology

4,866 232.76
A3P1000-FG256M

数据手册

ProASIC3 256-LBGA Tray Active Not Verified - - 147456 177 1000000 1.14V ~ 1.575V Surface Mount -55°C ~ 125°C (TJ) - - 256-FPBGA (17x17)
AFS600-FGG256I

AFS600-FGG256I

IC FPGA 119 I/O 256FBGA

Microchip Technology

136 239.14
AFS600-FGG256I

数据手册

Fusion® 256-LBGA Tray Active Not Verified - - 110592 119 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
A54SX32A-1PQG208I

A54SX32A-1PQG208I

IC FPGA 174 I/O 208QFP

Microchip Technology

3,868 247.18
A54SX32A-1PQG208I

数据手册

SX-A 208-BFQFP Tray Active Not Verified 2880 - - 174 48000 2.25V ~ 5.25V Surface Mount -40°C ~ 85°C (TA) - - 208-PQFP (28x28)
A3PE1500-2FGG676I

A3PE1500-2FGG676I

IC FPGA 444 I/O 676FBGA

Microchip Technology

3,378 262.99
A3PE1500-2FGG676I

数据手册

ProASIC3E 676-BGA Tray Active Not Verified - - 276480 444 1500000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 676-FBGA (27x27)
APA300-FG256I

APA300-FG256I

IC FPGA 186 I/O 256FBGA

Microchip Technology

3,551 273.86
APA300-FG256I

数据手册

ProASICPLUS 256-LBGA Tray Active Not Verified - - 73728 186 300000 2.3V ~ 2.7V Surface Mount -40°C ~ 85°C (TA) - - 256-FPBGA (17x17)
A3P1000-1FG484M

A3P1000-1FG484M

IC FPGA 300 I/O 484FBGA

Microchip Technology

4,867 281.23
A3P1000-1FG484M

数据手册

ProASIC3 484-BGA Tray Active Not Verified - - 147456 300 1000000 1.425V ~ 1.575V Surface Mount -55°C ~ 125°C (TJ) - - 484-FPBGA (23x23)