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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
A3P400-PQG208

A3P400-PQG208

IC FPGA 151 I/O 208QFP

Microchip Technology

3,537 36.27
A3P400-PQG208

数据手册

ProASIC3 208-BFQFP Tray Active Not Verified - - 55296 151 400000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 208-PQFP (28x28)
M2GL025-FG484

M2GL025-FG484

IC FPGA 267 I/O 484FBGA

Microchip Technology

4,474 57.79
M2GL025-FG484

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 27696 1130496 267 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
A3P600-2PQG208I

A3P600-2PQG208I

IC FPGA 154 I/O 208QFP

Microchip Technology

4,029 63.44
A3P600-2PQG208I

数据手册

ProASIC3 208-BFQFP Tray Active Not Verified - - 110592 154 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 208-PQFP (28x28)
A42MX09-PQG100I

A42MX09-PQG100I

IC FPGA 83 I/O 100QFP

Microchip Technology

4,803 148.61
A42MX09-PQG100I

数据手册

MX 100-BQFP Tray Active Not Verified - - - 83 14000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 100-PQFP (20x14)
A54SX72A-PQG208

A54SX72A-PQG208

IC FPGA 171 I/O 208QFP

Microchip Technology

1,675 318.88
A54SX72A-PQG208

数据手册

SX-A 208-BFQFP Tray Active Not Verified 6036 - - 171 108000 2.25V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 208-PQFP (28x28)
MPF200T-FCSG325I

MPF200T-FCSG325I

IC FPGA 170 I/O 325FPGA

Microchip Technology

1,364 386.96
MPF200T-FCSG325I

数据手册

PolarFire™ 325-LFBGA, FC Tray Active Not Verified - 192000 13619200 170 - 0.97V ~ 1.08V Surface Mount -40°C ~ 100°C (TJ) - - 325-FCBGA (11x14.5)
A42MX24-PQG208I

A42MX24-PQG208I

IC FPGA 176 I/O 208QFP

Microchip Technology

1,690 375.56
A42MX24-PQG208I

数据手册

MX 208-BFQFP Tray Active Not Verified - - - 176 36000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 208-PQFP (28x28)
A3PE3000-1PQG208I

A3PE3000-1PQG208I

IC FPGA 147 I/O 208QFP

Microchip Technology

2,318 460.75
A3PE3000-1PQG208I

数据手册

ProASIC3E 208-BFQFP Tray Active Not Verified - - 516096 147 3000000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 208-PQFP (28x28)
MPF300TS-FCG484I

MPF300TS-FCG484I

IC FPGA 244 I/O 484FCBGA

Microchip Technology

1,478 533.38
MPF300TS-FCG484I

数据手册

PolarFire™ 484-BBGA, FCBGA Tray Active Not Verified - 300000 21094400 244 - 0.97V ~ 1.08V Surface Mount -40°C ~ 100°C (TJ) - - 484-FCBGA (23x23)
MPF500T-FCG1152E

MPF500T-FCG1152E

IC FPGA 584 I/O 1152FCBGA

Microchip Technology

2,746 746.61
MPF500T-FCG1152E

数据手册

PolarFire™ 1152-BBGA, FCBGA Tray Active Not Verified - 481000 33792000 584 - 0.97V ~ 1.08V Surface Mount 0°C ~ 100°C (TJ) - - 1152-FCBGA (35x35)