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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
MPF300TS-FC484M

MPF300TS-FC484M

POLARFIRE FPGA 484-BGA

Microchip Technology

4,081 -
MPF300TS-FC484M

数据手册

PolarFire™ 484-BBGA Tray Active Not Verified - 300000 21600666 284 - 0.97V ~ 1.08V Surface Mount -55°C ~ 125°C (TJ) - - 484-FPBGA (23x23)
MPF500TS-FC784M

MPF500TS-FC784M

POLARFIRE FPGA 784-BGA

Microchip Technology

3,739 -
MPF500TS-FC784M

数据手册

PolarFire™ 784-BBGA, FCBGA Tray Active Not Verified - 481000 34603008 388 - 0.97V ~ 1.08V Surface Mount -55°C ~ 125°C (TJ) - - 784-FCBGA (29x29)
MPF200TS-FCS325M

MPF200TS-FCS325M

POLARFIRE FPGA 325-BGA

Microchip Technology

1,450 -
MPF200TS-FCS325M

数据手册

PolarFire™ 325-TFBGA Tray Active Not Verified - 192000 13946061 170 - 0.97V ~ 1.08V Surface Mount -55°C ~ 125°C (TJ) - - 325-BGA (11x11)
MPF300TS-FCS536M

MPF300TS-FCS536M

POLARFIRE FPGA 536-BGA

Microchip Technology

3,033 -
MPF300TS-FCS536M

数据手册

PolarFire™ 536-LFBGA Tray Active Not Verified - 300000 21600666 300 - 0.97V ~ 1.08V Surface Mount -55°C ~ 125°C (TJ) - - 536-BGA (16x16)
MPF500TS-FC1152M

MPF500TS-FC1152M

POLARFIRE FPGA 1152-BGA

Microchip Technology

1,814 -
MPF500TS-FC1152M

数据手册

PolarFire™ 1152-BBGA, FCBGA Tray Active Not Verified - 481000 34603008 584 - 0.97V ~ 1.08V Surface Mount -55°C ~ 125°C (TJ) - - 1152-FCBGA (35x35)
MPF300TS-FCV484M

MPF300TS-FCV484M

POLARFIRE FPGA 484-BGA

Microchip Technology

2,974 -
MPF300TS-FCV484M

数据手册

PolarFire™ 484-BFBGA Tray Active Not Verified - 300000 21600666 284 - 0.97V ~ 1.08V Surface Mount -55°C ~ 125°C (TJ) - - 484-FBGA (19x19)
M2GL005S-1TQG144T2

M2GL005S-1TQG144T2

M2GL005S-1TQG144T2

Microchip Technology

4,429 -
M2GL005S-1TQG144T2

数据手册

IGLOO2 144-LQFP Tray Active Not Verified - 6060 719872 84 - 1.14V ~ 2.625V Surface Mount -40°C ~ 125°C (TJ) - - 144-TQFP (20x20)
M2GL010S-1TQG144T2

M2GL010S-1TQG144T2

M2GL010S-1TQG144T2

Microchip Technology

4,223 -
M2GL010S-1TQG144T2

数据手册

IGLOO2 144-LQFP Tray Active Not Verified - 12084 933888 84 - 1.14V ~ 2.625V Surface Mount -40°C ~ 125°C (TJ) - - 144-TQFP (20x20)
MPF300T-FCVG484T2

MPF300T-FCVG484T2

MPF300T-FCVG484T2

Microchip Technology

4,853 -

-

PolarFire™ 484-BFBGA Tray Active Not Verified - 300000 21600666 284 - 0.97V ~ 1.08V Surface Mount -40°C ~ 125°C (TJ) - - 484-FBGA (19x19)
MPF300T-FCSG536T2

MPF300T-FCSG536T2

MPF300T-FCSG536T2

Microchip Technology

1,864 -
MPF300T-FCSG536T2

数据手册

PolarFire™ 536-LFBGA Tray Active Not Verified - 300000 21600666 300 - 0.97V ~ 1.08V Surface Mount -40°C ~ 125°C (TJ) - - 536-BGA (16x16)