产品中心

制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
RT4G150-CGG1657V

RT4G150-CGG1657V

RT4G150-CGG1657V

Microchip Technology

1,062 -

-

RTG4™ 1657-BFCCGA Bulk Active Not Verified - 151824 5325 - - 1.14V ~ 1.26V Surface Mount -55°C ~ 125°C (TJ) - - 1657-CCGA (42.5x42.5)
RT4G150-CQG352PROTO

RT4G150-CQG352PROTO

RT4G150-CQG352PROTO

Microchip Technology

3,277 -

-

RTG4™ 352-BFCQFP Exposed Pad and Tie Bar Bulk Active Not Verified - 151824 5325 166 - 1.14V ~ 1.26V Surface Mount -55°C ~ 125°C (TJ) - - 352-QFP (48x48)
RT4G150-1CBG1657PROTO

RT4G150-1CBG1657PROTO

RT4G150-1CBG1657PROTO

Microchip Technology

4,201 -

-

RTG4™ 1657-BCBGA Bulk Active Not Verified - 151824 5325 720 - 1.14V ~ 1.26V Surface Mount -55°C ~ 125°C (TJ) - - 1657-CBGA (42.5x42.5)
RT4G150-1CGG1657PROTO

RT4G150-1CGG1657PROTO

RT4G150-1CGG1657PROTO

Microchip Technology

2,173 -

-

RTG4™ 1657-BFCCGA Bulk Active Not Verified - 151824 5325 - - 1.14V ~ 1.26V Surface Mount -55°C ~ 125°C (TJ) - - 1657-CCGA (42.5x42.5)
RT4G150-1CGG1657B

RT4G150-1CGG1657B

RT4G150-1CGG1657B

Microchip Technology

1,264 -

-

RTG4™ 1657-BFCCGA Bulk Discontinued at Digi-Key Not Verified - 151824 5325 - - 1.14V ~ 1.26V Surface Mount -55°C ~ 125°C (TJ) - - 1657-CCGA (42.5x42.5)
RT4G150L-CQG352PROTO

RT4G150L-CQG352PROTO

RT4G150L-CQG352PROTO

Microchip Technology

2,802 -

-

RTG4™ 352-BFCQFP Exposed Pad and Tie Bar Bulk Active Not Verified - 151824 5200000 166 - 1.2V Surface Mount -55°C ~ 125°C - - 352-QFP (48x48)
RT4G150-CGG1657E

RT4G150-CGG1657E

RT4G150-CGG1657E

Microchip Technology

1,217 -

-

RTG4™ 1657-BFCCGA Bulk Active Not Verified - 151824 5325 - - 1.14V ~ 1.26V Surface Mount -55°C ~ 125°C (TJ) - - 1657-CCGA (42.5x42.5)
APA300-WAFERLOT

APA300-WAFERLOT

APA300-WAFERLOT

Microchip Technology

2,681 -

-

- - Bulk Obsolete - - - - - - - - - - - -
A42MX16-WAFERLOT

A42MX16-WAFERLOT

A42MX16-WAFERLOT

Microchip Technology

4,176 -

-

MX Die Bulk Obsolete - - 608 - - 24000 3V ~ 3.6V, 4.5V ~ 5.25V, 4.75V ~ 5.5V Surface Mount -55°C ~ 125°C (TC) - - Wafer
A42MX24-WAFERLOT

A42MX24-WAFERLOT

A42MX24-WAFERLOT

Microchip Technology

3,839 -

-

MX Die Bulk Obsolete - - 912 - - 36000 3V ~ 5.5V Surface Mount - - - Die