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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
MPF300TS-FC784M

MPF300TS-FC784M

MPF300TS-FC784M

Microchip Technology

4,938 -
MPF300TS-FC784M

数据手册

PolarFire™ 784-BBGA, FCBGA Tray Active Not Verified - 300000 21600666 388 - 0.97V ~ 1.08V Surface Mount -55°C ~ 125°C (TJ) - - 784-FCBGA (29x29)
MPF200T-FCSG325T2

MPF200T-FCSG325T2

MPF200T-FCSG325T2

Microchip Technology

2,414 -
MPF200T-FCSG325T2

数据手册

PolarFire™ 325-TFBGA Tray Active Not Verified - 192000 13946061 170 - 0.97V ~ 1.08V Surface Mount -40°C ~ 125°C (TJ) - - 325-BGA (11x11)
MPF300T-1FCVG484T2

MPF300T-1FCVG484T2

MPF300T-1FCVG484T2

Microchip Technology

4,259 -
MPF300T-1FCVG484T2

数据手册

PolarFire™ 484-BFBGA Tray Active Not Verified - 300000 21600666 284 - 0.97V ~ 1.08V Surface Mount -40°C ~ 125°C (TJ) - - 484-FBGA (19x19)
MPF100T-1FCG484T2

MPF100T-1FCG484T2

MPF100T-1FCG484T2

Microchip Technology

1,052 -
MPF100T-1FCG484T2

数据手册

PolarFire™ 484-BGA Tray Active Not Verified - 109000 7969178 244 - 0.97V ~ 1.08V Surface Mount -40°C ~ 125°C (TJ) - - 484-FPBGA (23x23)
MPF050T-FCSG325T2

MPF050T-FCSG325T2

MPF050T-FCSG325T2

Microchip Technology

3,482 -

-

- 325-TFBGA Tray Active Not Verified - 48000 3774874 164 - 0.97V ~ 1.08V Surface Mount -40°C ~ 125°C (TJ) - - 325-BGA (11x11)
MPF050T-1FCVG484T2

MPF050T-1FCVG484T2

MPF050T-1FCVG484T2

Microchip Technology

1,258 -

-

- 484-BFBGA Tray Active Not Verified - 48000 3774874 176 - 0.97V ~ 1.08V Surface Mount -40°C ~ 125°C (TJ) - - 484-FBGA (19x19)
MPF050T-FCVG484T2

MPF050T-FCVG484T2

MPF050T-FCVG484T2

Microchip Technology

2,842 -

-

- 484-BFBGA Tray Active Not Verified - 48000 3774874 176 - 0.97V ~ 1.08V Surface Mount -40°C ~ 125°C (TJ) - - 484-FBGA (19x19)
RT4G150-1CGG1657R

RT4G150-1CGG1657R

RT4G150-1CGG1657R

Microchip Technology

1,438 -

-

RTG4™ 1657-BFCCGA Bulk Active Not Verified - 151824 5325 - - 1.14V ~ 1.26V Surface Mount -55°C ~ 125°C (TJ) - - 1657-CCGA (42.5x42.5)
RT4G150-CQG352M

RT4G150-CQG352M

RT4G150-CQG352M

Microchip Technology

1,665 -

-

RTG4™ 352-BFCQFP Exposed Pad and Tie Bar Bulk Active Not Verified - 151824 5325 - - 1.14V ~ 1.26V Surface Mount -55°C ~ 125°C (TJ) - - 352-QFP (48x48)
RT4G150-CGG1657B

RT4G150-CGG1657B

RT4G150-CGG1657B

Microchip Technology

3,011 -

-

RTG4™ 1657-BFCCGA Bulk Active Not Verified - 151824 5325 - - 1.14V ~ 1.26V Surface Mount -55°C ~ 125°C (TJ) - - 1657-CCGA (42.5x42.5)