产品中心

制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
A3P1000-FGG256

A3P1000-FGG256

IC FPGA 177 I/O 256FBGA

Microchip Technology

4,834 70.82
A3P1000-FGG256

数据手册

ProASIC3 256-LBGA Tray Active Not Verified - - 147456 177 1000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)
A3P1000-PQG208

A3P1000-PQG208

IC FPGA 154 I/O 208QFP

Microchip Technology

444 73.38
A3P1000-PQG208

数据手册

ProASIC3 208-BFQFP Tray Active Not Verified - - 147456 154 1000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 208-PQFP (28x28)
A3P1000-FGG144I

A3P1000-FGG144I

IC FPGA 97 I/O 144FBGA

Microchip Technology

2,598 76.77
A3P1000-FGG144I

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 147456 97 1000000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 144-FPBGA (13x13)
A3P1000-FG144I

A3P1000-FG144I

IC FPGA 97 I/O 144FBGA

Microchip Technology

983 76.77
A3P1000-FG144I

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 147456 97 1000000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 144-FPBGA (13x13)
A3P1000-FGG484

A3P1000-FGG484

IC FPGA 300 I/O 484FBGA

Microchip Technology

4,910 81.39
A3P1000-FGG484

数据手册

ProASIC3 484-BGA Tray Active Not Verified - - 147456 300 1000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
A3P1000-FG256I

A3P1000-FG256I

IC FPGA 177 I/O 256FBGA

Microchip Technology

268 81.46
A3P1000-FG256I

数据手册

ProASIC3 256-LBGA Tray Active Not Verified - - 147456 177 1000000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
A40MX04-PLG44I

A40MX04-PLG44I

IC FPGA 34 I/O 44PLCC

Microchip Technology

2,725 82.02
A40MX04-PLG44I

数据手册

MX 44-LCC (J-Lead) Tray Active Not Verified - - - 34 6000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 44-PLCC (16.59x16.59)
A3P1000-PQG208I

A3P1000-PQG208I

IC FPGA 154 I/O 208QFP

Microchip Technology

1,015 84.40
A3P1000-PQG208I

数据手册

ProASIC3 208-BFQFP Tray Active Not Verified - - 147456 154 1000000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 208-PQFP (28x28)
A3PE600-FGG484I

A3PE600-FGG484I

IC FPGA 270 I/O 484FBGA

Microchip Technology

120 84.80
A3PE600-FGG484I

数据手册

ProASIC3E 484-BGA Tray Active Not Verified - - 110592 270 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
AGL600V5-FGG144I

AGL600V5-FGG144I

IC FPGA 97 I/O 144FBGA

Microchip Technology

184 85.96
AGL600V5-FGG144I

数据手册

IGLOO 144-LBGA Tray Active Not Verified - 13824 110592 97 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 85°C (TA) - - 144-FPBGA (13x13)