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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
A3PE1500-PQG208I

A3PE1500-PQG208I

IC FPGA 147 I/O 208QFP

Microchip Technology

4,314 194.25
A3PE1500-PQG208I

数据手册

ProASIC3E 208-BFQFP Tray Active Not Verified - - 276480 147 1500000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 208-PQFP (28x28)
A42MX16-VQG100I

A42MX16-VQG100I

IC FPGA 83 I/O 100VQFP

Microchip Technology

213 197.82
A42MX16-VQG100I

数据手册

MX 100-TQFP Tray Active Not Verified - - - 83 24000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 100-VQFP (14x14)
MPF100T-FCVG484I

MPF100T-FCVG484I

IC FPGA 284 I/O 484FBGA

Microchip Technology

3,007 226.47
MPF100T-FCVG484I

数据手册

PolarFire™ 484-BFBGA Tray Active Not Verified - 109000 7782400 284 - 0.97V ~ 1.08V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (19x19)
A3PE1500-FG484I

A3PE1500-FG484I

IC FPGA 280 I/O 484FBGA

Microchip Technology

2,961 207.97
A3PE1500-FG484I

数据手册

ProASIC3E 484-BGA Tray Active Not Verified - - 276480 280 1500000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
A42MX16-PQG160I

A42MX16-PQG160I

IC FPGA 125 I/O 160QFP

Microchip Technology

4,803 209.89
A42MX16-PQG160I

数据手册

MX 160-BQFP Tray Active Not Verified - - - 125 24000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 160-PQFP (28x28)
A3P1000-FG144M

A3P1000-FG144M

IC FPGA 97 I/O 144FBGA

Microchip Technology

1,385 221.01
A3P1000-FG144M

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 147456 97 1000000 1.425V ~ 1.575V Surface Mount -55°C ~ 125°C (TJ) - - 144-FPBGA (13x13)
A3PE1500-FG676I

A3PE1500-FG676I

IC FPGA 444 I/O 676FBGA

Microchip Technology

1,099 222.46
A3PE1500-FG676I

数据手册

ProASIC3E 676-BGA Tray Active Not Verified - - 276480 444 1500000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 676-FBGA (27x27)
MPF100T-FCSG325I

MPF100T-FCSG325I

IC FPGA 170 I/O 325FPGA

Microchip Technology

1,443 256.01
MPF100T-FCSG325I

数据手册

PolarFire™ 325-LFBGA, FCBGA Tray Active Not Verified - 109000 7782400 170 - 0.97V ~ 1.08V Surface Mount -40°C ~ 100°C (TJ) - - 325-FCBGA (11x11)
AFS600-FG256I

AFS600-FG256I

IC FPGA 119 I/O 256FBGA

Microchip Technology

111 239.14
AFS600-FG256I

数据手册

Fusion® 256-LBGA Tray Active Not Verified - - 110592 119 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
A3P1000-PQG208M

A3P1000-PQG208M

IC FPGA 154 I/O 208QFP

Microchip Technology

1,464 242.12
A3P1000-PQG208M

数据手册

ProASIC3 208-BFQFP Tray Active Not Verified - - 147456 154 1000000 1.425V ~ 1.575V Surface Mount -55°C ~ 125°C (TJ) - - 208-PQFP (28x28)