产品中心

制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
APA300-FG144I

APA300-FG144I

IC FPGA 100 I/O 144FBGA

Microchip Technology

171 252.65
APA300-FG144I

数据手册

ProASICPLUS 144-LBGA Tray Active Not Verified - - 73728 100 300000 2.3V ~ 2.7V Surface Mount -40°C ~ 85°C (TA) - - 144-FPBGA (13x13)
MPF200T-FCVG484I

MPF200T-FCVG484I

IC FPGA 284 I/O 484FBGA

Microchip Technology

2,156 336.49
MPF200T-FCVG484I

数据手册

PolarFire™ 484-BFBGA Tray Active Not Verified - 192000 13619200 284 - 0.97V ~ 1.08V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (19x19)
APA450-PQG208I

APA450-PQG208I

IC FPGA 158 I/O 208QFP

Microchip Technology

135 321.60
APA450-PQG208I

数据手册

ProASICPLUS 208-BFQFP Tray Active Not Verified - - 110592 158 450000 2.3V ~ 2.7V Surface Mount -40°C ~ 85°C (TA) - - 208-PQFP (28x28)
A3PE3000-FGG484

A3PE3000-FGG484

IC FPGA 341 I/O 484FBGA

Microchip Technology

2,889 376.99
A3PE3000-FGG484

数据手册

ProASIC3E 484-BGA Tray Active Not Verified - - 516096 341 3000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
MPF300T-FCG484I

MPF300T-FCG484I

IC FPGA 244 I/O 484FCBGA

Microchip Technology

4,283 457.19
MPF300T-FCG484I

数据手册

PolarFire™ 484-BBGA, FCBGA Tray Active Not Verified - 300000 21094400 244 - 0.97V ~ 1.08V Surface Mount -40°C ~ 100°C (TJ) - - 484-FCBGA (23x23)
M2GL090T-1FG484M

M2GL090T-1FG484M

IC FPGA 267 I/O 484FBGA

Microchip Technology

4,423 418.75
M2GL090T-1FG484M

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 86184 2648064 267 - 1.14V ~ 2.625V Surface Mount -55°C ~ 125°C (TJ) - - 484-FPBGA (23x23)
A3PE3000-FG484I

A3PE3000-FG484I

IC FPGA 341 I/O 484FBGA

Microchip Technology

2,590 433.52
A3PE3000-FG484I

数据手册

ProASIC3E 484-BGA Tray Active Not Verified - - 516096 341 3000000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
MPF300T-FCG784I

MPF300T-FCG784I

IC FPGA 388 I/O 784FCBGA

Microchip Technology

3,970 507.98
MPF300T-FCG784I

数据手册

PolarFire™ 784-BBGA, FCBGA Tray Active Not Verified - 300000 21094400 388 - 0.97V ~ 1.08V Surface Mount -40°C ~ 100°C (TJ) - - 784-FCBGA (29x29)
MPF300T-FCVG484I

MPF300T-FCVG484I

IC FPGA 284 I/O 484FCBGA

Microchip Technology

1,070 525.76
MPF300T-FCVG484I

数据手册

PolarFire™ 484-BBGA, FCBGA Tray Active Not Verified - 300000 21094400 284 - 0.97V ~ 1.08V Surface Mount -40°C ~ 100°C (TJ) - - 484-FCBGA (19x19)
M1A3PE3000-2FG484I

M1A3PE3000-2FG484I

IC FPGA 341 I/O 484FBGA

Microchip Technology

1,389 512.25
M1A3PE3000-2FG484I

数据手册

ProASIC3E 484-BGA Tray Active Not Verified - - 516096 341 3000000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)