产品中心

制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
A3PE600-2FGG484I

A3PE600-2FGG484I

IC FPGA 270 I/O 484FBGA

Microchip Technology

4,145 99.87
A3PE600-2FGG484I

数据手册

ProASIC3E 484-BGA Tray Active Not Verified - - 110592 270 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
M2GL060-FGG676I

M2GL060-FGG676I

IC FPGA 387 I/O 676FBGA

Microchip Technology

3,152 106.70
M2GL060-FGG676I

数据手册

IGLOO2 676-BGA Tray Active Not Verified - 56520 1869824 387 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 676-FBGA (27x27)
M2GL060T-FGG676I

M2GL060T-FGG676I

IC FPGA 387 I/O 676FBGA

Microchip Technology

4,339 115.99
M2GL060T-FGG676I

数据手册

IGLOO2 676-BGA Tray Active Not Verified - 56520 1869824 387 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 676-FBGA (27x27)
AGL1000V2-FGG256I

AGL1000V2-FGG256I

IC FPGA 177 I/O 256FBGA

Microchip Technology

2,466 141.38
AGL1000V2-FGG256I

数据手册

IGLOO 256-LBGA Tray Active Not Verified - 24576 147456 177 1000000 1.14V ~ 1.575V Surface Mount -40°C ~ 85°C (TA) - - 256-FPBGA (17x17)
A42MX16-PQG100

A42MX16-PQG100

IC FPGA 83 I/O 100QFP

Microchip Technology

2,638 161.34
A42MX16-PQG100

数据手册

MX 100-BQFP Tray Active Not Verified - - - 83 24000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 100-PQFP (20x14)
M2GL090-FG484I

M2GL090-FG484I

IC FPGA 267 I/O 484FBGA

Microchip Technology

4,596 171.98
M2GL090-FG484I

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 86184 2648064 267 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
M2GL150-FCVG484I

M2GL150-FCVG484I

IC FPGA 248 I/O 484BGA

Microchip Technology

148 274.36
M2GL150-FCVG484I

数据手册

IGLOO2 484-BFBGA Tray Active Not Verified - 146124 5120000 248 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 484-BGA
MPF200T-FCSG325E

MPF200T-FCSG325E

IC FPGA 170 I/O 325FPGA

Microchip Technology

3,977 322.48
MPF200T-FCSG325E

数据手册

PolarFire™ 325-LFBGA, FC Tray Active Not Verified - 192000 13619200 170 - 0.97V ~ 1.08V Surface Mount 0°C ~ 100°C (TJ) - - 325-FCBGA (11x14.5)
A54SX72A-PQG208I

A54SX72A-PQG208I

IC FPGA 171 I/O 208QFP

Microchip Technology

4,133 414.21
A54SX72A-PQG208I

数据手册

SX-A 208-BFQFP Tray Active Not Verified 6036 - - 171 108000 2.25V ~ 5.25V Surface Mount -40°C ~ 85°C (TA) - - 208-PQFP (28x28)
APA600-PQG208I

APA600-PQG208I

IC FPGA 158 I/O 208QFP

Microchip Technology

4,923 736.37
APA600-PQG208I

数据手册

ProASICPLUS 208-BFQFP Tray Active Not Verified - - 129024 158 600000 2.3V ~ 2.7V Surface Mount -40°C ~ 85°C (TA) - - 208-PQFP (28x28)