产品中心

制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
M2GL010-VFG256

M2GL010-VFG256

IC FPGA 138 I/O 256FBGA

Microchip Technology

291 25.82
M2GL010-VFG256

数据手册

IGLOO2 256-LFBGA Tray Active Not Verified - 12084 933888 138 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (14x14)
AGL250V2-CSG196I

AGL250V2-CSG196I

IC FPGA 143 I/O 196CSP

Microchip Technology

420 28.21
AGL250V2-CSG196I

数据手册

IGLOO 196-TFBGA, CSBGA Tray Active Not Verified - 6144 36864 143 250000 1.14V ~ 1.575V Surface Mount -40°C ~ 85°C (TA) - - 196-CSP (8x8)
AGL250V2-FG144I

AGL250V2-FG144I

IC FPGA 97 I/O 144FBGA

Microchip Technology

115 28.42
AGL250V2-FG144I

数据手册

IGLOO 144-LBGA Tray Active Not Verified - 6144 36864 97 250000 1.14V ~ 1.575V Surface Mount -40°C ~ 85°C (TA) - - 144-FPBGA (13x13)
M2GL025-VFG400

M2GL025-VFG400

IC FPGA 195 I/O 400VFBGA

Microchip Technology

106 51.88
M2GL025-VFG400

数据手册

IGLOO2 400-LFBGA Tray Active Not Verified - 27696 1130496 195 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 400-VFBGA (17x17)
M1A3P600-FGG256I

M1A3P600-FGG256I

IC FPGA 177 I/O 256FBGA

Microchip Technology

2,109 53.08
M1A3P600-FGG256I

数据手册

ProASIC3 256-LBGA Tray Active Not Verified - - 110592 177 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
M2GL025-FGG484

M2GL025-FGG484

IC FPGA 267 I/O 484FBGA

Microchip Technology

144 57.79
M2GL025-FGG484

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 27696 1130496 267 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
A54SX08A-TQG100

A54SX08A-TQG100

IC FPGA 81 I/O 100TQFP

Microchip Technology

3,006 62.14
A54SX08A-TQG100

数据手册

SX-A 100-LQFP Tray Active Not Verified 768 - - 81 12000 2.25V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 100-TQFP (14x14)
M2GL025T-FGG484I

M2GL025T-FGG484I

IC FPGA 267 I/O 484FBGA

Microchip Technology

3,758 72.23
M2GL025T-FGG484I

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 27696 1130496 267 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
A3PE600-FG484I

A3PE600-FG484I

IC FPGA 270 I/O 484FBGA

Microchip Technology

107 84.80
A3PE600-FG484I

数据手册

ProASIC3E 484-BGA Tray Active Not Verified - - 110592 270 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
M2GL050-FGG484I

M2GL050-FGG484I

IC FPGA 267 I/O 484FBGA

Microchip Technology

2,562 96.76
M2GL050-FGG484I

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 56340 1869824 267 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)