产品中心

制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
AT40K10-2DQU

AT40K10-2DQU

IC FPGA 161 I/O 208QFP

Microchip Technology

2,563 30.78
AT40K10-2DQU

数据手册

AT40K/KLV 208-BFQFP Tray Active Not Verified - 576 4608 161 20000 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TC) - - 208-PQFP (28x28)
EX64-TQG64A

EX64-TQG64A

IC FPGA 41 I/O 64TQFP

Microchip Technology

3,997 31.96
EX64-TQG64A

数据手册

EX 64-LQFP Tray Active Not Verified - 128 - 41 3000 2.3V ~ 2.7V Surface Mount -40°C ~ 125°C (TA) - - 64-TQFP (10x10)
M2GL010-FG484

M2GL010-FG484

IC FPGA 233 I/O 484FBGA

Microchip Technology

3,662 33.42
M2GL010-FG484

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 12084 933888 233 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M2GL010-FGG484

M2GL010-FGG484

IC FPGA 233 I/O 484FBGA

Microchip Technology

1,747 33.42
M2GL010-FGG484

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 12084 933888 233 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M1A3P400-FGG144

M1A3P400-FGG144

IC FPGA 97 I/O 144FBGA

Microchip Technology

2,369 31.67

-

ProASIC3 144-LBGA Tray Active Not Verified - - 55296 97 400000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 144-FPBGA (13x13)
M1A3P400-FG144

M1A3P400-FG144

IC FPGA 97 I/O 144FBGA

Microchip Technology

2,643 31.67

-

ProASIC3 144-LBGA Tray Active Not Verified - - 55296 97 400000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 144-FPBGA (13x13)
M2GL010S-1TQG144I

M2GL010S-1TQG144I

IC FPGA 84 I/O 144TQFP

Microchip Technology

3,104 33.95
M2GL010S-1TQG144I

数据手册

IGLOO2 - Tray Active Not Verified - 12084 933888 84 - 1.14V ~ 2.625V - -40°C ~ 100°C (TJ) - - -
M2GL010T-1VF256I

M2GL010T-1VF256I

IC FPGA 138 I/O 256FBGA

Microchip Technology

4,022 35.78
M2GL010T-1VF256I

数据手册

IGLOO2 256-LFBGA Tray Active Not Verified - 12084 933888 138 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (14x14)
M2GL010T-1VFG256I

M2GL010T-1VFG256I

IC FPGA 138 I/O 256FBGA

Microchip Technology

1,390 35.78
M2GL010T-1VFG256I

数据手册

IGLOO2 256-LFBGA Tray Active Not Verified - 12084 933888 138 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (14x14)
M2GL010T-1VF400

M2GL010T-1VF400

IC FPGA 195 I/O 400VFBGA

Microchip Technology

1,886 34.87
M2GL010T-1VF400

数据手册

IGLOO2 400-LFBGA Tray Active Not Verified - 12084 933888 195 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 400-VFBGA (17x17)