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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
M1A3P400-1FGG256

M1A3P400-1FGG256

IC FPGA 178 I/O 256FBGA

Microchip Technology

4,419 39.16

-

ProASIC3 256-LBGA Tray Active Not Verified - - 55296 178 400000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)
A3P400-1FG256

A3P400-1FG256

IC FPGA 178 I/O 256FBGA

Microchip Technology

4,158 39.16
A3P400-1FG256

数据手册

ProASIC3 256-LBGA Tray Active Not Verified - - 55296 178 400000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)
M2GL010T-1FG484

M2GL010T-1FG484

IC FPGA 233 I/O 484FBGA

Microchip Technology

1,220 41.78
M2GL010T-1FG484

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 12084 933888 233 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M2GL010T-1FGG484

M2GL010T-1FGG484

IC FPGA 233 I/O 484FBGA

Microchip Technology

4,127 41.78
M2GL010T-1FGG484

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 12084 933888 233 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M2GL010T-FG484I

M2GL010T-FG484I

IC FPGA 233 I/O 484FBGA

Microchip Technology

3,976 41.78
M2GL010T-FG484I

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 12084 933888 233 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
AT40K20-2BGC

AT40K20-2BGC

IC FPGA 289 I/O 352SBGA

Microchip Technology

2,499 -

-

AT40K/KLV 352-LBGA Tray Obsolete Not Verified - 1024 8192 289 30000 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C - - 352-SBGA (35x35)
AGL400V5-CS196

AGL400V5-CS196

IC FPGA 143 I/O 196CSP

Microchip Technology

2,983 39.91
AGL400V5-CS196

数据手册

IGLOO 196-TFBGA, CSBGA Tray Active Not Verified - 9216 55296 143 400000 1.425V ~ 1.575V Surface Mount 0°C ~ 70°C (TA) - - 196-CSP (8x8)
M1A3P400-1FGG144I

M1A3P400-1FGG144I

IC FPGA 97 I/O 144FBGA

Microchip Technology

4,347 39.52

-

ProASIC3 144-LBGA Tray Active Not Verified - - 55296 97 400000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 144-FPBGA (13x13)
A3P400-1FG144I

A3P400-1FG144I

IC FPGA 97 I/O 144FBGA

Microchip Technology

3,067 39.52
A3P400-1FG144I

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 55296 97 400000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 144-FPBGA (13x13)
A3P400-1FGG144I

A3P400-1FGG144I

IC FPGA 97 I/O 144FBGA

Microchip Technology

1,296 39.52
A3P400-1FGG144I

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 55296 97 400000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 144-FPBGA (13x13)