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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
M1A3P400-2FG256

M1A3P400-2FG256

IC FPGA 178 I/O 256FBGA

Microchip Technology

3,145 42.57

-

ProASIC3 256-LBGA Tray Active Not Verified - - 55296 178 400000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)
M1A3P400-2FGG256

M1A3P400-2FGG256

IC FPGA 178 I/O 256FBGA

Microchip Technology

3,698 42.57

-

ProASIC3 256-LBGA Tray Active Not Verified - - 55296 178 400000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)
A3P400-2FG256

A3P400-2FG256

IC FPGA 178 I/O 256FBGA

Microchip Technology

4,056 42.57
A3P400-2FG256

数据手册

ProASIC3 256-LBGA Tray Active Not Verified - - 55296 178 400000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)
A3P400-2FGG256

A3P400-2FGG256

IC FPGA 178 I/O 256FBGA

Microchip Technology

4,186 42.57
A3P400-2FGG256

数据手册

ProASIC3 256-LBGA Tray Active Not Verified - - 55296 178 400000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)
A3P400-2PQG208

A3P400-2PQG208

IC FPGA 151 I/O 208QFP

Microchip Technology

2,062 42.91
A3P400-2PQG208

数据手册

ProASIC3 208-BFQFP Tray Active Not Verified - - 55296 151 400000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 208-PQFP (28x28)
M1A3P400-2PQG208

M1A3P400-2PQG208

IC FPGA 151 I/O 208QFP

Microchip Technology

2,546 42.91

-

ProASIC3 208-BFQFP Tray Active Not Verified - - 55296 151 400000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 208-PQFP (28x28)
M1A3P400-2FGG144I

M1A3P400-2FGG144I

IC FPGA 97 I/O 144FBGA

Microchip Technology

2,515 42.99

-

ProASIC3 144-LBGA Tray Active Not Verified - - 55296 97 400000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 144-FPBGA (13x13)
M1A3P400-2FG144I

M1A3P400-2FG144I

IC FPGA 97 I/O 144FBGA

Microchip Technology

2,334 42.99

-

ProASIC3 144-LBGA Tray Active Not Verified - - 55296 97 400000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 144-FPBGA (13x13)
A3P400-2FGG144I

A3P400-2FGG144I

IC FPGA 97 I/O 144FBGA

Microchip Technology

3,124 42.99
A3P400-2FGG144I

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 55296 97 400000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 144-FPBGA (13x13)
AGL400V2-CS196

AGL400V2-CS196

IC FPGA 143 I/O 196CSP

Microchip Technology

1,747 43.58
AGL400V2-CS196

数据手册

IGLOO 196-TFBGA, CSBGA Tray Active Not Verified - 9216 55296 143 400000 1.14V ~ 1.575V Surface Mount 0°C ~ 70°C (TA) - - 196-CSP (8x8)